dac16fs Analog Devices, Inc., dac16fs Datasheet - Page 3

• Manufacturer Part Number: dac16fs
• Description: 16-bit High Speed Current-output Dac
• Manufacturer: Analog Devices, Inc.

REV. B
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V
REF GND to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +1.0 V
I
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 8 mA
Digital Input Voltage to DGND . . . . . . . . . . . . . . . . . . . V
Operating Temperature Range
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150 C
Storage Temperature . . . . . . . . . . . . . . . . . . –65 C to +150 C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 C
Package Type
24-Lead Plastic DIP (P)
24-Lead Plastic SOL (S)
NOTE
1
Model
DAC16GS
DAC16FP
DAC16FS
DAC16GBC
REF
device in socket.
CC
CC
EE
JA
A
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
GS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to +70 C
= +25 C unless otherwise noted)
is specified for worst case mounting conditions, i.e.,
to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –18.0 V
to V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V
DB15 (MSB)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA
EE
Die Size 0.129 x 0.153 inch, 19,737 sq. mils
(3.277 x 3.886 mm, 12.73 sq. mm)
The DAC16 Contains 330 Transistors.
Substrate is V
DB14
DB13
DB12
DB10
DB11
. . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +25.0 V
DICE CHARACTERISTICS
V
DB9
CC
DGND I
DB8
Grade DNL (max)
EE
1
2
2
1
Polarity.
DB7
REF
C
DB6
COMP
62
70
JA
1
DB5
I
OUT
AGND
DB4
32
22
JA
JC
is specified for
REF GND
V
DB0 (LSB)
DB1
DB2
DB3
EE
Temperature Ranges
0 C to +70 C
–40 C to +85 C
–40 C to +85 C
+25 C
ORDERING GUIDE
Units
C/W
C/W
CC
–3–
CAUTION
1. Stresses above those listed under “Absolute Maximum Rat-
2. Digital inputs and outputs are protected; however, perma-
3. Remove power before inserting or removing units from their
Pin
(P, S) Name
1
2
3
4–19
20
21
22
23
24
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this
specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device
reliability.
nent damage may occur on unprotected units from high en-
ergy electrostatic fields. Keep units in conductive foam or
packaging at all times until ready to use. Use proper anti-
static handling procedures.
sockets.
I
DGND
V
DB15–DB0 16-Bit Digital Input Bus. DB15 is the MSB.
V
REF GND
AGND
I
C
REF
OUT
CC
EE
COMP
Package Descriptions
24-Lead SOL
24-Lead PDIP
24-Lead SOL
Die
DB15 (MSB)
DGND
PIN CONFIGURATION
DB14
DB13
DB12
DB11
DB10
I
DB9
DB8
DB7
V
REF
PIN DESCRIPTION
Digital Ground
Analog Ground/Output Reference
Description
Reference Current Input
+5 V Digital Supply
–15 V Analog Supply
Reference Current Return
Current Output
Current Ladder Compensation
CC
24-Lead DIP (P, S)
10
11
12
1
2
3
4
5
6
7
8
9
(Not to Scale)
TOP VIEW
DAC16
24
23
22
21
20
19
18
17
16
15
14
13
C
I
AGND
REF GND
V
DB0 (LSB)
DB1
DB2
DB3
DB4
DB5
DB6
OUT
EE
COMP
Package Options
R-24
N-24
R-24
DAC16