tda9935hw-c1 NXP Semiconductors, tda9935hw-c1 Datasheet
tda9935hw-c1
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tda9935hw-c1 Summary of contents
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TDA9935 Dual 14-bit 160 Msample/s, 2 Digital-to-Analog Converter (DAC) Rev. 04 — 17 September 2007 1. General description The TDA9935 is optimized to reduce architecture complexity and overall system cost. Thanks to its direct IF conversion capabilities, it ...
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... NXP Semiconductors 4. Ordering information Table 1. Type number TDA9935HW 5. Block diagram (1) Pins 1, 3, 61, 65, 76 and 80. (2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) Pins 18, 26, 36, 43, 63 and 78. Fig 1. Block diagram TDA9935_4 Product data sheet ...
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... Symbol V CCA i.c. V CCA AGND CLK CLKN AGND i.c. DGND TDA9935_4 Product data sheet Dual 14-bit 160 Msample TDA9935HW 11 I13 I12 12 I11 13 14 I10 15 I9 DGND Pin description [1] Pin Type Description 1 S analog supply voltage ...
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... NXP Semiconductors Table 2. Symbol V CCD I13 I12 I11 I10 I9 I8 DGND DEC DGND DEC I1 I0 DGND DGND Q13 Q12 Q11 Q10 DGND DEC DEC DGND DGND DGND TDA9935_4 Product data sheet Dual 14-bit 160 Msample/s, 2 Pin description … ...
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... NXP Semiconductors Table 2. Symbol V CCD DGND DGND DGND DGND DGND GAPD GAPOUT QVIRES IVIRES V CCA AGND DEC AGND V CCA AGND AGND QOUTN QOUT AGND AGND IOUTN IOUT AGND AGND V CCA AGND DEC AGND V CCA [1] Type description: S: Supply; G: Ground; I: Input; O: Output. TDA9935_4 ...
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... NXP Semiconductors 7. Functional description The DAC is a segmented architecture composed of a 7-bit thermometer sub-DAC, and the remaining 7-bit in a binary weighted sub-DAC. The device produces two complementary current outputs on both channels, respectively pins IOUT/IOUTN and QOUT/QOUTN which need to be connected via a load resistor to the ground ...
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... NXP Semiconductors 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V digital supply voltage CCD V analog supply voltage CCA V supply voltage difference between CCA-CCD the analog and digital supply voltages V voltage at input pins I V voltage at output pins ...
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... NXP Semiconductors 10. Characteristics Table 5. Characteristics 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(FS) Figure 10; unless otherwise specified. Symbol Parameter Supplies V digital supply voltage CCD V analog supply voltage CCA I digital supply current CCD I analog supply current ...
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... NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(FS) Figure 10; unless otherwise specified. Symbol Parameter Digital filter specification (FIR); see N order f data input rate I(D) R ripple in pass bandwidth PBW ...
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... NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(FS) Figure 10; unless otherwise specified. Symbol Parameter S/N signal-to-noise ratio ACPR adjacent channel power ratio [1] Guaranteed by design. Table 6. Band gap disable (GAPD) ...
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... NXP Semiconductors 20 output (dB 100 140 180 0 0.2 0.4 normalized frequency (f Fig 6. FIR filter frequency response Table 7. Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) H(16) H(17) H(18) H(19) H(20) H(21) H(22) TDA9935_4 Product data sheet Dual 14-bit 160 Msample/s, 2 001aab122 normalized output 0.6 0.8 1 OUT CLK Fig 7. FIR filter impulse response Interpolation FIR filter coefficient Coeffi ...
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... NXP Semiconductors 11. Application information CCA 1 k CLKN 100 AGND 001aab126 Fig 8. Single-ended clock schematic TDA9935_4 Product data sheet Dual 14-bit 160 Msample/s, 2 TDA9935 CLK Fig 9. Differential clock schematic Rev. 04 — 17 September 2007 TDA9935 interpolating DAC AGND TDA9935 ...
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... NXP Semiconductors AGND 3 CCA 1 3 CCA 3 3 AGND AGND 4 CLK 5 CLKN 6 AGND AGND 7 i.c. 8 DGND DGND CCD 10 3.3 V I13 11 I12 12 I11 13 I10 DGND DGND 17 C DEC ...
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... NXP Semiconductors 12. Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body mm; exposed die pad y exposed die pad pin 1 index DIMENSIONS (mm are the original dimensions) A UNIT max 0.15 1.05 0.27 mm 1.2 0.25 0.05 0.95 0.17 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included ...
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... NXP Semiconductors 13. Abbreviations Table 8. Acronym BW BWA CDMA EDGE FIR IF LMDS LSB MSB PLL PMOS SFDR WCDMA WLL 14. Glossary 14.1 Static parameters DNL — Differential Non-Linearity. The difference between the ideal and the measured output value between successive DAC codes. INL — Integral Non-Linearity. The deviation of the transfer function from a best-fit straight line (linear regression computation) ...
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... Amended the (alternative) descriptive title TDA9935_3 20070611 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Extended abbreviations list in Section 13. TDA9935_2 ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 6 8 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Glossary ...