tda9884 NXP Semiconductors, tda9884 Datasheet - Page 58

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tda9884

Manufacturer Part Number
tda9884
Description
Tda9884 I2c-bus Controlled Multistandard Alignment-free If-pll For Mobile Reception
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
20. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
8
8.1
8.1.1
8.1.2
8.2
8.2.1
8.2.2
8.2.3
8.2.4
9
10
11
12
13
14
15
15.1
15.2
15.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 7
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 20
Thermal characteristics. . . . . . . . . . . . . . . . . . 21
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 21
Application information. . . . . . . . . . . . . . . . . . 47
Test information . . . . . . . . . . . . . . . . . . . . . . . . 48
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 50
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2
C-bus control . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
VIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Tuner AGC and VIF-AGC . . . . . . . . . . . . . . . . . 8
VIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . . 8
FPLL detector . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCO and divider . . . . . . . . . . . . . . . . . . . . . . . . 9
AFC and digital acquisition help . . . . . . . . . . . . 9
Video demodulator and amplifier . . . . . . . . . . 10
Sound carrier trap . . . . . . . . . . . . . . . . . . . . . . 10
SIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . 11
Single reference QSS mixer . . . . . . . . . . . . . . 11
AM demodulator . . . . . . . . . . . . . . . . . . . . . . . 11
FM demodulator and acquisition help. . . . . . . 12
Audio amplifier and mute time constant . . . . . 12
Internal voltage stabilizer . . . . . . . . . . . . . . . . 13
I
Read format . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . 14
Data byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write format . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Subaddress. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Data byte for switching mode . . . . . . . . . . . . . 16
Data byte for adjust mode. . . . . . . . . . . . . . . . 17
Data byte for data mode . . . . . . . . . . . . . . . . . 19
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 52
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 52
2
C-bus transceiver and module address . . . . 13
I
2
C-bus controlled multistandard alignment-free IF-PLL
15.4
15.5
16
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 55
Revision history . . . . . . . . . . . . . . . . . . . . . . . 55
Legal information . . . . . . . . . . . . . . . . . . . . . . 56
Contact information . . . . . . . . . . . . . . . . . . . . 56
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 53
Package related soldering information . . . . . . 53
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 56
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Document identifier: TDA9884_2
TDA9884
Date of release: 12 May 2006
All rights reserved.

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