pca9306gm NXP Semiconductors, pca9306gm Datasheet
pca9306gm
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pca9306gm Summary of contents
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PCA9306 Dual bidirectional I Rev. 02 — 21 February 2007 1. General description The PCA9306 is a dual bidirectional I enable (EN) input, and is operational from 1 3 bias(ref)(2) The PCA9306 allows bidirectional voltage ...
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... NXP Semiconductors All channels have the same electrical characteristics and there is minimal deviation from one output to another in voltage or propagation delay. This is a benefit over discrete transistor voltage translation solutions, since the fabrication of the switch is symmetrical. The translator provides excellent ESD protection to lower voltage devices, and at the same time protects less ESD-resistant devices ...
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... PCA9306DC 306C VSSOP8 [2] PCA9306DP1 306T TSSOP8 [3] PCA9306DC1 306U VSSOP8 [4] PCA9306GM P6X XQFN8 [1] Also known as MSOP8. [2] Same footprint and pinout as the Texas Instruments PCA9306DCT. [3] Same footprint and pinout as the Texas Instruments PCA9306DCU. [4] ‘X’ will change based on date code. 4. Functional diagram Fig 1. Logic diagram of PCA9306 (positive logic) ...
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... Fig 3. Pin configuration for TSSOP8 (MSOP8) GND 1 VREF1 2 PCA9306DC1 3 SCL1 SDA1 4 002aab843 Fig 5. Pin configuration for VSSOP8 (DC1) terminal 1 index area GND 1 PCA9306GM VREF1 2 SCL1 3 Transparent top view Fig 7. Pin configuration for XQFN8 © NXP B.V. 2007. All rights reserved VREF2 6 SCL2 5 SDA2 8 ...
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... NXP Semiconductors 5.2 Pin description Table 2. Symbol GND VREF1 SCL1 SDA1 SDA2 SCL2 VREF2 EN 6. Functional description Refer to 6.1 Function table Table HIGH level LOW level. Input [ controlled by the V operation. PCA9306_2 Product data sheet Dual bidirectional I Pin description Pin ...
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... NXP Semiconductors 7. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Over operating free-air temperature range. Symbol V ref(1) V bias(ref)( I stg [1] The input and input/output negative voltage ratings may be exceeded if the input and input/output clamp current ratings are observed ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics +85 C, unless otherwise specified. amb Symbol Parameter V input clamping voltage IK I HIGH-level input current IH C input capacitance on pin EN i(EN) C off-state input/output capacitance io(off) C on-state input/output capacitance io(on) [2] R ON-state resistance on [1] All typical values are ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics (translating down +85 C, unless otherwise specified. Values guaranteed by design. amb Symbol Parameter Conditions I(EN LOW-to-HIGH from (input) SCL2 or SDA2 PLH propagation delay to (output) SCL1 or SDA1 t HIGH-to-LOW ...
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... NXP Semiconductors 11. Application information (1) The applied voltages at V Fig 9. Typical application circuit (switch always enabled) (1) In the Enabled mode, the applied enable voltage and the applied voltage at V Fig 10. Typical application circuit (switch enable control) PCA9306_2 Product data sheet Dual bidirectional I ...
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... NXP Semiconductors 11.1 Bidirectional translation For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to higher voltage), the EN input must be connected to VREF2 and both pins pulled to HIGH side V regulate the EN input. A filter capacitor on VREF2 is recommended. The I output can be totem-pole or open-drain (pull-up resistors may be required) and the ...
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... NXP Semiconductors Table 10. Calculated for V V pu( 3.3 V 2.5 V 1.8 V 1.5 V 1.2 V [1] + compensate for V PCA9306_2 Product data sheet Dual bidirectional I Pull-up resistor values = 0.35 V; assumes output driver V OL Pull-up resistor value ( ) 15 mA [1] Nominal +10 % Nominal 310 341 197 217 143 158 97 106 range and resistor tolerance ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 mm 0.5 0.00 0.15 1.55 OUTLINE VERSION IEC SOT902 Fig 15 ...
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... NXP Semiconductors 13. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... Revision history Document ID Release date PCA9306_2 20070221 • Modifications: Table 1 “Ordering – changed topside mark for type number PCA9306GM from “P06” to “P6X” – added PCA9306_1 20061020 PCA9306_2 Product data sheet Dual bidirectional I maximum peak temperature = MSL limit, damage level ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 5 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Application information 11.1 Bidirectional translation ...