pca9698 NXP Semiconductors, pca9698 Datasheet - Page 42

• Manufacturer Part Number: pca9698
• Description: 40-bit Fm+ I2c-bus Advanced I/o Port With Reset, Oe And Int
• Manufacturer: NXP Semiconductors

Philips Semiconductors
15. Handling information
16. Soldering
PCA9698_2
Product data sheet
16.1 Introduction to soldering surface mount packages
16.2 Reflow soldering
16.3 Wave soldering
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215 C to 260 C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Table 16.
Table 17.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Package thickness
< 2.5 mm
Package thickness
< 1.6 mm
1.6 mm to 2.5 mm
2.5 mm
2.5 mm
July 2004)
2004)
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
Pb-free process - package peak reflow temperatures (from J-STD-020C July
Volume mm
260 C + 0 C
260 C + 0 C
250 C + 0 C
40-bit Fm+ I
Rev. 02 — 19 July 2006
Volume mm
240 C + 0/ 5 C
225 C + 0/ 5 C
3
< 350
2
C-bus advanced I/O port with RESET, OE and INT
3
< 350
Volume mm
2000
260 C + 0 C
250 C + 0 C
245 C + 0 C
3
350 to
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Volume mm
225 C + 0/ 5 C
225 C + 0/ 5 C
Volume mm
260 C + 0 C
245 C + 0 C
245 C + 0 C
PCA9698
3
350
3
> 2000
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