pca9674a NXP Semiconductors, pca9674a Datasheet - Page 29

• Manufacturer Part Number: pca9674a
• Description: Remote 8-bit I/o Expander For Fm+ I2c-bus With Interrupt
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Product data sheet
PCA9674_PCA9674A_2
Table 10.
Table 11.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 29. Temperature profiles for large and small components
2.5
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
11
29.
Rev. 02 — 12 October 2006
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
Remote 8-bit I/O expander for Fm+ I
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
220
220
PCA9674/74A
350
temperature
peak
2
C-bus with interrupt
> 2000
260
245
245
© NXP B.V. 2006. All rights reserved.
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