pca9548ad NXP Semiconductors, pca9548ad Datasheet - Page 23

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pca9548ad

Manufacturer Part Number
pca9548ad
Description
8-channel I2c Switch With Reset
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
14. Abbreviations
15. Revision history
Table 13.
PCA9548A_2
Product data sheet
Document ID
PCA9548_2
(9397 750 14726)
Modifications:
PCA9548A_1
(9397 750 13297)
Revision history
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 12.
Acronym
CDM
ESD
HBM
IC
I
I/O
LSB
MM
MSB
PCB
POR
SMBus
2
C-bus
Release date
20060925
20050415
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
changed (old) Section 4. “Marking” to
Section 6.3 “RESET
Table 5 “Limiting
“... should not exceed 125 C.”
Figure 16 “Definition of RESET timing”
Abbreviations
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
Integrated Circuit
Inter-Integrated Circuit bus
Input/Output
Least Significant Bit
Machine Model
Most Significant Bit
Printed-Circuit Board
Power-On Reset
System Management Bus
Data sheet status
Product data sheet
Product data sheet
Rev. 02 — 25 September 2006
values”,
input”, second sentence: changed symbol “t
Table note
10 C measured in the atmosphere of the reflow oven. The package
1: changed “... should not exceed 150 C.” to
Section 3.1 “Ordering options”
modified (removed LEDx signal)
Change notice
-
-
8-channel I
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
2
C-bus switch with reset
Supersedes
PCA9548A_1
-
WL
PCA9548A
” to “t
w(rst)L
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