tda8000t NXP Semiconductors, tda8000t Datasheet - Page 15

• Manufacturer Part Number: tda8000t
• Description: Smart Card Interface
• Manufacturer: NXP Semiconductors

Philips Semiconductors
1996 Dec 12
Data lines [I/O1, I/O2, I/O1( C), I/O2( C)]; note 5
V
V
I
V
V
I
V
Z
R
t
Protections
T
I
I
I
Timing
t
t
t
SYMBOL
IL
IL
r
CC(sd)
PP(sd)
I/O(sd)
act
de
3
, t
IDLE
sd
OH
OL
OH
OL
IDLE
Smart card interface
pu
f
HIGH level output voltage on I/O
LOW level output voltage on I/O
LOW level input current on I/O( C) I/O( C) grounded;
HIGH level output voltage on
I/O( C)
LOW level output voltage on
I/O( C)
LOW level input current on I/O
voltage on I/O outside a session
impedance on I/O( C) outside a
session
internal pull-up resistance between
I/O and V
rise and fall times
shut-down local temperature
shut-down current at V
shut-down current at V
shut-down current at I/O
activation sequence duration
deactivation sequence duration
start of the window for sending
CLK to the card
CC
PARAMETER
CC
PP
4.5 < V
4.5 < V
I
4.5 < V
4.5 < V
I
I
I/O( C) grounded
I
I/O( C) grounded;
I/O connected to V
4.5 < V
I
I/O grounded
I/O grounded; I
I/O grounded; I/O( C)
connected to V
C
from I/O to I/O( C)
see Fig.6
see Fig.8
see Fig.6
OH
OH
I/O
I/O
I/O( C)
i
= C
= 1 mA;
= 0
= 20 A
= 200 A
CONDITIONS
o
= 1 mA;
SUP
I/O( C)
SUP
I/O( C)
I/O
= 30 pF
15
< 5.5
< 5.5;
< 5.5;
< 5.5;
< 5.5;
I/O( C)
SUP
CC
= 0
4
2.4
4
10
17
3
250
250
175
90
MIN.
TDA8000; TDA8000T
20
135
TYP.
Product specification
V
65
V
70
0.4
23
1
5
500
500
140
500
5
500
5
230
140
CC
SUP
MAX.
+ 0.2
+ 0.2
UNIT
V
V
mV
mA
V
mV
mA
V
M
k
mA
mA
mA
C
A
A
s
s
s
s