tda8007bhl/c3 NXP Semiconductors, tda8007bhl/c3 Datasheet - Page 35

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tda8007bhl/c3

Manufacturer Part Number
tda8007bhl/c3
Description
Double Multiprotocol Ic Card Interface
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
12 CHARACTERISTICS
V
2003 Feb 18
Supplies
V
V
I
I
I
Voltage supervisor; see Fig.13
V
V
C
V
V
I
C
t
O
Active HIGH option
V
I
Active LOW option
I
V
DD(pd)
DD(sm)
DD(oper)
o
W
OL
OH
DD
SYMBOL
DD
DDA
th1
hys1
th2
o
OH
OL
APACITOR CONNECTION
o
Double multiprotocol IC card interface
UTPUT
= 3.3 V; V
:
PIN
RSTOUT (open-drain output)
supply voltage
supply voltage for step-up
converter
supply current in
Power-down mode
supply current in sleep
mode
supply current in operating
modem
threshold voltage on
pin V
hysteresis on V
threshold voltage
output voltage
output current
output capacitance
alarm pulse width
HIGH-level output voltage
LOW-level output current
HIGH-level output current
LOW-level output voltage
DDA
= 3.3 V; T
DD
PARAMETER
:
PIN
amb
DELAY
th1
= 25 C; unless otherwise specified.
cards inactive; f
cards active; V
f
cards active; f
5 V cards
I
f
V
3 V cards
I
f
falling
V
V
C
I
V
V
I
CLK
CC1
XTAL
CC1
XTAL
OH
OL
DD
DELAY
DELAY
OL
OH
DELAY
V
V
= 2 mA
DD
DD
= 1 mA
= 0 V
= 0 Hz; f
= 2.7 V
= 65 mA; I
= 50 mA; I
= 5 V
= 20 MHz; f
= 20 MHz; f
= 2.7 V
= 5 V
= 0 V (charge)
= V
= 22 nF
CONDITIONS
DD
XTAL
CLK
(discharge)
35
CC
CC2
CC2
XTAL
CLK
CLK
= 0 Hz
= 5 V;
= 0 Hz
= 15 mA;
= 30 mA;
= 0 Hz
= 10 MHz;
= 10 MHz
2.7
V
2.10
50
1
0.8V
0.3
DD
MIN.
DD
1.25
2
10
TYP.
2
Product specification
6.0
6.0
350
3
5.5
315
215
100
2.50
170
V
V
10
+0.4
TDA8007B
10
DD
DD
MAX.
+ 0.3
+ 0.3
UNIT
V
V
mA
mA
mA
mA
mA
V
mV
V
V
mA
nF
ms
V
V
A
A
A
A

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