tda8777hl/33/c1 NXP Semiconductors, tda8777hl/33/c1 Datasheet - Page 18

• Manufacturer Part Number: tda8777hl/33/c1
• Description: Triple 10-bit Video Dac, Up To 330 Mhz Sample Frequency
• Manufacturer: NXP Semiconductors

Philips Semiconductors
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5
Blanking and sync pulse insertion . . . . . . . . . . 6
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Triple 10-bit video DAC, up to 330 MHz sample frequency
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [e-mail].
Document identifier: TDA8777_4
TDA8777
Date of release: 11 April 2006
All rights reserved.