ADN8810-EVAL Analog Devices, ADN8810-EVAL Datasheet - Page 14

• Manufacturer Part Number: ADN8810-EVAL
• Description: 12-bit High Output Current Source
• Manufacturer: Analog Devices

ADN8810
LOGIC GROUND
To improve thermal dissipation, the slug on the bottom of the
LFCSP package should be soldered to the PC board with
multiple vias into a low noise ground plane. Connecting these
vias to a copper area on the bottom side of the board will
further improve thermal dissipation.
Use identical trace lengths for the two output sense resistors.
These lengths are shown as X and Y in Figure 24. Differences in
trace lengths cause differences in parasitic series resistance.
Because the sense resistors can be as low as 1.37 Ω, small
parasitic differences can lower both the output current accuracy
and the output impedance. Application Note AN-619 shows a
good layout for these traces.
DIGITAL LOGIC
TO OTHER 5V
RETURN
Figure 24. Use Identical Trace Lengths for Sense Resistors
Figure 23. Star Supply and Ground Technique
ADN8810
DVDD
5V
IOUT
R
AVDD
FB
SN
POWER SUPPLY
ADN8810
R
SN
PVDD
3V
R
Y
DGND
DVSS
SN
GND
AVSS
IOUT
X
TO LOAD
LOAD
LOAD
GND
Rev. 0 | Page 14 of 16
SUGGESTED PAD LAYOUT FOR CP-24 PACKAGE
shows the dimensions for the PC board pad layout for the
ADN8810. The package is a 4 mm × 4 mm, 24-lead LFCSP. The
metallic slug underneath the package should be soldered to a
copper pad connected to AVSS, the lowest supply voltage to the
ADN8810. For single-supply applications, this is ground. Use
multiple vias to this pad to improve the thermal dissipation of
the package.
0.172
(4.36)
DIMENSIONS ARE SHOWN
IN INCHES AND (MM).
0.004
(0.10)
Figure 25. Suggested PC Board Layout for CP-24 Pad Landing
(2.78)
0.109
CONTROLLING DIMENSIONS ARE IN MILLIMETERS
0.106
(2.68)
0.027
(0.69)
PACKAGE
OUTLINE
(0.28)
(0.50)
0.011
0.020