74lvc2g38dp NXP Semiconductors, 74lvc2g38dp Datasheet
74lvc2g38dp
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74lvc2g38dp Summary of contents
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Dual 2-input NAND gate; open drain Rev. 05 — 4 September 2007 1. General description The 74LVC2G38 provides a 2-input NAND function. The outputs of the 74LVC2G38 devices are open drain and can be connected to other open-drain outputs ...
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... Type number Package Temperature range 74LVC2G38DP +125 C 74LVC2G38DC +125 C 74LVC2G38GT +125 C 74LVC2G38GM +125 C 4. Marking Table 2. Marking code Type number 74LVC2G38DP 74LVC2G38DC 74LVC2G38GT 74LVC2G38GM 5. Functional diagram mnb129 Fig 1. Logic symbol Fig 3. Functional diagram (one gate) ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 4. Pin configuration TSSOP8 and VSSOP8 74LVC2G38 GND 4 Transparent top view Fig 5. Pin configuration XSON8 6.2 Pin description Table 3. Pin description Symbol Pin TSSOP8, VSSOP8 GND ...
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... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level high-impedance OFF-state 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +125 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V LOW-level output voltage OL I input leakage current I I power-off leakage current V OFF I supply current ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground 0 V); for test circuit see Symbol Parameter Conditions t OFF-state to LOW nA nY; see PZL propagation delay LOW to OFF-state nA nY; see PLZ propagation delay ...
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... NXP Semiconductors Table 9. Measurement points Supply voltage Input 1. 1.95 V 0.5 2 2.7 V 0.5 2.7 V 1 3.6 V 1 5.5 V 0.5 Test data is given in Table 10 Definitions for test circuit Load resistor Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 mm 0.5 0.00 0.15 1.55 OUTLINE VERSION IEC SOT902 Fig 12 ...
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... Revision history Document ID Release date 74LVC2G38_5 20070904 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • In current. 74LVC2G38_4 20060516 ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Abbreviations ...