vsc834 Vitesse Semiconductor Corp, vsc834 Datasheet - Page 15

• Manufacturer Part Number: vsc834
• Description: 2.5gb/s 17 X 17 Crosspoint Switch With Input Signal Activity Isa Monitoring
• Manufacturer: Vitesse Semiconductor Corp

Datasheet
VSC834
G52247-0, Rev 4.2
02/09/01
Package Information
DETAIL B
E1
P
REF.
ccc
D1
E1
b
M
N
aaa
D
E
c
e
A
A1
P
F
g
F
10
DIMENSIONAL REFERENCES
26.80
26.80
0.60
0.65
1.05
1.65
0.40
MIN.
0.15
20
19
BOTTOM VIEW
18
17
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
16
15
24.13 (BSC.)
24.13 (BSC.)
1.27 TYP.
14
5
27.00
13
27.00
D1
256
12
Tel: (800) VITESSE • FAX: [phone] • Email: [e-mail]
NOM.
0.65
0.75
1.15
1.80
20
11
10
9
VITESSE
8
aaa C
SEMICONDUCTOR CORPORATION
7
6
27mm 256 BGA Package Drawing
c
5
27.20
27.20
4
1.95
0.85
0.25
MAX.
0.70
1.25
0.25
0.50
3
A1
2
1
Internet: www.vitesse.com
A
C
E
L
U
W
G
N
R
J
D
A
B
Y
F
H
K
M
T
V
P
NOTES:
-C-
6
8. CAVITY DEPTH VARIOUS WITH DIE THICKNESS
9. SUBSTRATE MATERIAL BASE IS COPPER.
10. BILATERAL TOLENANCE ZONE IS APPLIED TO EACH SIDE OF PACKAGE BODY
12. DIMENSION F IS THE MAX. ENCAP. HEIGHT
4. "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
11. 45 DEG 0.5 mm CHAMFER CORNER AND WHITE DOT FOR PIN 1 IDENTIFICATION.
2. "e" REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
3. "M" REPRESENTS THE BASIC SOLDER BALL MATRIX SIZE,
5.
6. PRIMARY DATUM -C- AND SEATING PLANE ARE DEFINED BY THE
7. PACKAGE SURFACE SHALL BE BLACK OXIDE.
1. ALL DIMENSIONS ARE IN MILLIMETERS.
//
e
AND SYMBOL "N" IS THE MAXIMUM ALLOWABLE NUMBER OF
PARALLEL TO PRIMARY DATUM -C- .
BALLS AFTER DEPOPULATING.
DIMENSION "aaa" IS MEASURED PARALLEL TO PRIMARY DATUM -C- .
SPHERICAL CROWNS OF THE SOLDER BALLS.
ccc
C
with Input Signal Activity (ISA) Monitoring
CORNER
e
11
45 DEGREE 0.5MM CHAMFER
2.5Gb/s 17x17 Crosspoint Switch
g
TOP VIEW
D
DETAIL B
b
g
4
0.30 S C A S B S
0.10 S C
(4 PLCS)
-A-
-B-
0.10
E
Page 15