mt45w1mw16bdgb Micron Semiconductor Products, mt45w1mw16bdgb Datasheet - Page 57

• Manufacturer Part Number: mt45w1mw16bdgb
• Description: 16mb 1 Meg X 16 Async/page/burst Cellularram 1.0 Memory
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 47:
SEATING
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron Technology, Inc.
inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of their respective owners. This data
PDF: 09005aef81cb58ed/Source: 09005aef81c7a667
16mb_burst_cr1_0_p23z_2.fm - Rev. H 4/08 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
PRE-REFLOW BALL
DIAMETER IS 0.35
ON A 0.30 SMD
BALL PAD.
sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
PLANE
6.00
0.10 A
54X Ø0.37
BALL A6
3.00
54-Ball VFBGA
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
1.875
1. All dimensions in millimeters; MAX/MIN or typical, as noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W1MW16BDGB uses “green” packaging.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
6.00 ±0.10
0.25mm per side.
0.75
TYP
3.75
16Mb: 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
3.00 ±0.05
0.75 TYP
BALL A1
BALL A1 ID
times occur.
0.70 ±0.05
4.00 ±0.05
57
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
96.5% Sn, 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
BALL A1 ID