mt46h32m32lfjg-6it Micron Semiconductor Products, mt46h32m32lfjg-6it Datasheet - Page 17

• Manufacturer Part Number: mt46h32m32lfjg-6it
• Description: Nand Flash And Mobile Lpdram 168-ball Package-on-package Pop Mcp Combination Memory Ti Omap?
• Manufacturer: Micron Semiconductor Products

Rev. D, Preliminary – 04/08
Rev. C, Advance – 02/08
Rev. B – 12/07
Rev. A – 12/07
PDF: 09005aef83070ff3
168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09
This data sheet contains initial characterization limits that are subject to change upon full characterization of production devices.
• Changed status to preliminary.
• Figure 2: 168-Ball Part Number Chart on page 2: Added JI part number and package
• Figure 3: Ball Assignment: 168-Ball VFBGA (x8 NAND Flash and x16 LPDRAM); Figure
• Removed former capacitance tables. See component data sheets for capacitance.
• Figure 8: 168-Ball VFBGA (Package Code: JI): Added figure.
• Figure 2: 168-Ball Part Number Chart: Updated self-refresh current definition.
• Figure 7: 168-Ball VFBGA (Package Code: JG): Updated package diagram with 0.15 tol-
• “LP-DRAM-Specific Features”: Added SRR feature.
• Separated original single ball-assignment table into separate tables: Table 2, “NAND
• Figure 3, 137-Ball TFBGA (LPDDR) Ball Assignments, on page 4: changed pin P1 from
• Removed “Mobile” from LP-DRAM references.
• Initial release.
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Micron and the Micron logo are trademarks of Micron Technology, Inc.
code.
4: 168-Ball VFBGA (NAND x16; LPDDR x32) Ball Assignments; Table 2, “NAND Flash
Ball Descriptions,”; Table 3, “LPDDR Ball Descriptions,”; and Table 4, “Non-Device-
Specific Ball Descriptions,”: Updated ball assignments.
erance.
Flash Ball Descriptions,” Table 3, “LPDDR Ball Descriptions,” and Table 4, “Non-De-
vice-Specific Ball Descriptions.”
NC to RFU.
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168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP
17
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©2007 Micron Technology, Inc. All rights reserved.
Revision History