s29as008j Meet Spansion Inc., s29as008j Datasheet - Page 53

• Manufacturer Part Number: s29as008j
• Description: 8 Megabit 1 M X 8-bit/512 K X 16-bit Cmos 1.8 Volt-only Boot Sector Flash Memory
• Manufacturer: Meet Spansion Inc.

21.2
June 6, 2008 S29AS008J_00_03
U4B045 - Wafer Level Chip Scale Package (WLCSP)
D a t a
PACKAGE
JEDEC
D X E
SYMBOL
SD / SE
MD
ME
Ø b
A1
A2
D1
E1
eE
eD
eG
eH
SF
eF
D
A
E
n
S h e e t
MIN
0.12
4.21
1.99
0.15
---
---
4.26 mm x 2.04 mm
PACKAGE
3.89 BSC
1.60 BSC
0.40 BSC
0.40 BSC
0.40 BSC
0.40 BSC
0.40 BSC
0.20 BSC
U4B 045
NOM
0.40
4.26
2.04
0.20
0.00
N/A
---
---
11
45
9
( A d v a n c e
MAX
0.60
4.31
2.10
0.25
---
---
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
SOLDER BALL PLACEMENT
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29AS008J
NOTE
I n f o r m a t i o n )
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3672 / f16.038.65 / 1.8.8
53