ltc2752lx Linear Technology Corporation, ltc2752lx Datasheet - Page 23

• Manufacturer Part Number: ltc2752lx
• Description: Ltc2752 Dual16-bit Softspan Iout Dacs Features
• Manufacturer: Linear Technology Corporation

package DescripTion
0.20 – 0.30
0.50 BSC
1.30 MIN
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE
2. DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
1
2
48
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
RECOMMENDED SOLDER PAD LAYOUT
PACKAGE OUTLINE
11° – 13°
0.45 – 0.75
11° – 13°
1.00 REF
7.15 – 7.25
5.50 REF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
R0.08 – 0.20
SECTION A – A
0° – 7°
(Reference LTC DWG # 05-08-1760 Rev Ø)
48-Lead Plastic LQFP (7mm × 7mm)
GAUGE PLANE
0.25
5.50 REF
LX Package
7.15 – 7.25
0.09 – 0.20
C0.30 – 0.50
1
2
4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
5. DRAWING IS NOT TO SCALE
0.50
BSC
48
SEE NOTE: 4
0.17 – 0.27
9.00 BSC
7.00 BSC
A
LTC2752
0.05 – 0.15
1.35 – 1.45
A
7.00 BSC

LX48 LQFP 0907 REVØ
9.00 BSC
2752f
1.60
MAX