mcf51qe128 Freescale Semiconductor, Inc, mcf51qe128 Datasheet - Page 11

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mcf51qe128

Manufacturer Part Number
mcf51qe128
Description
Mcf51qe Flexis 32-bit Coldfire? V1 Microcontroller
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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where:
For most applications, P
is:
Solving
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring P
for a known T
for any value of T
3.5
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits,
normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure
that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. During
the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the
charge device model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete
DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
Freescale Semiconductor
Equation 1
T
θ
P
P
P
JA
A
D
int
I/O
ESD Protection and Latch-Up Immunity
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
A
. Using this value of K, the values of P
int
DD
A
+ P
Latch-up
.
Machine
× V
and
Human
Model
Body
I/O
DD
I/O
Equation 2
, Watts — chip internal power
<< P
MCF51QE128 Series Advance Information Data Sheet, Rev. 4
Series resistance
Storage capacitance
Number of pulses per pin
Series resistance
Storage capacitance
Number of pulses per pin
Minimum input voltage limit
Maximum input voltage limit
int
and can be neglected. An approximate relationship between P
for K gives:
Table 6. ESD and Latch-up Test Conditions
K = P
Description
D
P
T
× (T
D
J
= K ÷ (T
= T
A
D
+ 273°C) + θ
and T
A
+ (P
J
J
+ 273°C)
can be obtained by solving
D
× θ
JA
JA
Symbol
)
R1
R1
× (P
C
C
D
)
2
Value
1500
– 2.5
100
200
Equation 1
7.5
3
0
3
D
and T
Electrical Characteristics
and
Unit
pF
pF
J
Ω
Ω
Equation 2
V
V
(if P
D
I/O
(at equilibrium)
is neglected)
iteratively
Eqn. 1
Eqn. 2
Eqn. 3
11

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