il33290 IK Semicon Co., Ltd, il33290 Datasheet
il33290
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il33290 Summary of contents
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... CMOS logic, circuitry, and DMOS power FETs. Although the IL33290 was principally designed for automotive applications suited for other serial communication applications parametrically specified over an ambient temperature range of -40°C ≤ ≤ V ≤ ...
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... Pin Function Description Notes 1. NC pins should not have any connections made to them. NC pins are not guaranteed to be open circuits. IL33290 Rev. 00 ...
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... ESD data available upon request. 4. ESD1 testing is performed in accordance with the Human Body Model (C 5. ESD2 testing is performed in accordance with the Machine Model (C 6. Nonrepetitive clamping capability at 25°C. 7. Lead soldering temperature limit is for 10 seconds maximum duration. IL33290 = 100 pF 1500 Ω). ZAP ZAP = 200 pF Ω ...
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... Thermal Shutdown performance (T ≤ 5.25 V, 8.0 V ≤ and noting T value at which ISO falls below 0 and noting the value at which ISO rises above 0 guaranteed by design but not production tested. LIM IL33290 ≤ -40°C ≤ T ≤ 125° pin X Rev. 00 ...
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... Hys(ISO) IH(ISO) 18. ISO has internal current limiting. continued) ≤ 5.25 V, 8.0 V ≤ Monitor RX, Value of ISO voltage at which Monitor RX, Value of ISO voltage at which IL(ISO) IL33290 ≤ -40°C ≤ T ≤ 125° transitions to 0 transitions to 0 Rev. 00 ...
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... 22. Step T voltage from 0 0 ≤ 5.25 V, 8.0 V ≤ 0 Time measured from V until V DD IH(ISO) . Time measured from V until V DD IL(ISO) IL33290 ≤ -40°C ≤ T ≤ 125°C, C reaches 0 ISO BB reaches 0 ISO BB Rev. 00 ...
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... Application Information IL33290 Rev. 00 ...
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... M T NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. Package Dimensions D SUFFIX SOIC (MS - 012AA SEATING PLANE IL33290 Dimension, mm Symbol MIN MAX A 4.80 5.00 3.80 4. 1.35 1.75 D 0.33 0. ...