isl3873a Intersil Corporation, isl3873a Datasheet - Page 42

• Manufacturer Part Number: isl3873a
• Description: Wireless Lan Integrated Medium Access Controller With Baseband Processor
• Manufacturer: Intersil Corporation

Plastic Ball Grid Array Packages (BGA)
o
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.
However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
7585 Irvine Center Drive
Suite 100
Irvine, CA 92618
TEL: [phone]
FAX: [phone]
CORNER I.D.
CORNER
C
0.006
0.003
0.15
0.08
A
A1
S
A
A1
b
M
M
A1
C
C
A2
16
A B
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
15
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
14
13
For information regarding Intersil Corporation and its products, see www.intersil.com
12 11 10 9
BOTTOM VIEW
S
SIDE VIEW
TOP VIEW
42
A
D1
D
Intersil Corporation
2401 Palm Bay Rd.
Palm Bay, FL 32905
TEL: [phone]
FAX: [phone]
8
7 6 5
4
SEATING PLANE
ALL ROWS AND COLUMNS
3
2
1
A
E
e
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B
E1
bbb
A1
CORNER I.D.
A1
CORNER
aaa
ISL3873A
C
C
EUROPE
Intersil Europe Sarl
Ave. C - F Ramuz 43
CH-1009 Pully
Switzerland
TEL: [phone]
FAX: [phone]
V192.14x14
192 BALL PLASTIC BALL GRID ARRAY PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: MILLIMETER. Converted inch
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
6. Dimension “A” includes standoff height “A1”, package body
7. Dimension “b” is measured at the maximum ball diameter,
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
MD/ME
D1/E1
D/E
bbb
aaa
A1
A2
dimensions are not necessarily exact.
and “E” dimensions, respectively.
ical crowns of the contact balls.
thickness and lid or cap height “A2”.
parallel to the primary datum C.
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
N
A
b
e
0.012
0.033
0.016
0.547
0.468
MIN
-
0.032 BSC
INCHES
16 x 16
0.004
0.005
192
ASIA
Intersil Corporation
Unit 1804 18/F Guangdong Water Building
83 Austin Road
TST, Kowloon Hong Kong
TEL: [phone]
FAX: [phone]
MAX
0.059
0.016
0.039
0.020
0.555
0.476
13.90
11.90
0.31
0.41
0.83
MILLIMETERS
MIN
-
0.80 BSC
16 x 16
0.10
0.12
192
14.10
12.10
1.40
0.41
0.99
0.51
MAX
Rev. 1 1/01
NOTES
7
3
-
-
-
-
-
-
-
-
-