irf6662 International Rectifier Corp., irf6662 Datasheet - Page 3

• Manufacturer Part Number: irf6662
• Description: Directfet? Power Mosfet
• Manufacturer: International Rectifier Corp.

board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
Surface mounted on 1 in. square Cu
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.05
0.10
0.02
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
0.01
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
Parameter
Parameter
t 1 , Rectangular Pulse Duration (sec)
0.001
small clip heatsink (still air)
τ
Mounted to a PCB with
J
τ
J
τ
1
Ci= τi/Ri
τ
1
Ci τi/Ri
T
R
R
0.01
C
θ
1
R
is measured at
1
measured with thermocouple incontact with top (Drain) of part.
τ
2
τ
R
2
2
R
2
0.1
R
τ
3
3
R
τ
T
3
3
J
Typ.
12.5
of approximately 90°C.
–––
–––
1.0
20
τ
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
4
τ
4
R
4
-40 to + 150
4
τ
1
A
τ
Max.
A
footprint full size board with
metalized back and with small
clip heatsink (still air)
270
2.8
1.8
89
Ri (°C/W)
1.2801
8.7256
21.7500
13.2511
Mounted on minimum
Max.
–––
–––
–––
1.4
45
10
0.000322
0.164798
2.2576
69
τi (sec)
IRF6662
100
Units
Units
°C/W
°C
W
3