sa10qa03 Nihon Inter Electronics (NIEC), sa10qa03 Datasheet

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sa10qa03

Manufacturer Part Number
sa10qa03
Description
Sbd ,schottky Diodes
Manufacturer
Nihon Inter Electronics (NIEC)
Datasheet

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1.0A Avg.
■最大定格 Maximum Ratings
■電気的・熱的特性 Electrical/ Thermal Characteristics
■定格・特性曲線
く り 返 し ピ ー ク 逆 電 圧
Repetitive Peak Reverse Voltage
Direct Forward Current
Average rectified Forward Current
Surge Forward Current
Operating Junction Temperature Range
Storage Temperature Range
Peak Reverse Current
Peak Forward Voltage
Thermal Resistance
*1:プリント基板実装/Alumina Substrate Mounted (Soldering Land=6×6mm)
*2:プリント基板実装/Glass-Epoxy Substrate Mounted (Soldering Land=6×6mm)
Item
Item
Symbol
Symbol
R
R
V
I
V
T
I
I
T
th(j-a)
th(j-l)
FSM
RRM
I
RM
DC
FM
stg
o
jw
30
FIG.1
FIG.3
Direct Current
RECT 180℃
Rectangular Wave
50% Duty
Volts
(Junction to Ambient)
接合部・周囲間
20
(50Hz正弦半波1サイクル非くり返し)
Half Sine Wave,1cycle, Non-repetitive
接合部・リード間(Junction to Lead)
−40∼+150
−40∼+150
Conditions
V
I
I
V
FM
FM
RM
(Tl: Lead Temperature)
RM
SBD
30
Ta=73℃
=0.7A T
=1.0A T
Tl=124℃,V
Conditions
=30V T
=5V T
T
a
=86℃
*1
,V
a
RM
a
a
a
=25℃
*1(アルミナ基板実装)
*2(ガラエボ基板実装)
RM
=25℃
=25℃
=25℃
*1
=15V
=15V
1.41
1.0
Unit
V
A
A
A
■OUTLINE DRAWING(mm)
■APPROX. NET WEIGHT:0.004 g
Min.
FIG.2
FIG.4
0.3
SA10QA03
Typ.
0.42
0.47
0.2
0.3
10
1
0.2
Max.
0.45
100
100
150
30
参考はんだパッド形状
(e.g. Soldering Pad)
2.0
0.2
1.9
℃/W
Unit
μA
mA
V
0.8

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sa10qa03 Summary of contents

Page 1

... Ambient) *2(ガラエボ基板実装) 接合部・リード間(Junction to Lead) SA10QA03 ■OUTLINE DRAWING(mm) Unit V 1. ...

Page 2

... Avg. 30 Volts FIG.5 FIG.7 FIG.9 SBD SA10QA03 FIG.6 FIG.8 FIG.10 ...

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