74LVC823APW,118 NXP Semiconductors, 74LVC823APW,118 Datasheet - Page 5

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74LVC823APW,118

Manufacturer Part Number
74LVC823APW,118
Description
IC 9BIT D FF POS-EDGE 24TSSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Type
D-Type Busr
Datasheet

Specifications of 74LVC823APW,118

Package / Case
24-TSSOP
Function
Master Reset
Output Type
Tri-State Non Inverted
Number Of Elements
1
Number Of Bits Per Element
9
Frequency - Clock
200MHz
Delay Time - Propagation
3.7ns
Trigger Type
Positive Edge
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Number Of Circuits
1
Logic Family
LVC
Logic Type
D-Type Edge Triggered Flip-Flop
Polarity
Non-Inverting
Input Type
Single-Ended
Propagation Delay Time
5.1 ns at 3.3 V
High Level Output Current
- 24 mA
Supply Voltage (max)
3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Supply Voltage (min)
1.2 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
74LVC823APW-T
74LVC823APW-T
935262541118
Philips Semiconductors
6. Pinning information
9397 750 13128
Product data sheet
Fig 5. Pin configuration SO24 and (T)SSOP24.
GND
MR
OE
D0
D1
D2
D3
D4
D5
D6
D7
D8
10
11
12
1
2
3
4
5
6
7
8
9
6.1 Pinning
6.2 Pin description
Table 3:
Symbol
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
823
001aaa845
Pin description
Pin
OE
D0
D1
D2
D3
D4
D5
D6
D7
D8
MR
GND
CP
CE
Q8
Q7
Q6
24
23
22
21
20
19
18
17
16
15
14
13
V
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
CE
CP
CC
Description
output enable input (active LOW)
data input
data input
data input
data input
data input
data input
data input
data input
data input
master reset input (active LOW)
ground (0 V)
clock input (LOW-to-HIGH; edge-triggered)
clock enable input (active LOW)
3-state flip-flop output
3-state flip-flop output
3-state flip-flop output
Rev. 02 — 10 May 2004
9-bit D-type flip-flop with 5 V tolerant inputs/outputs
Fig 6. Pin configuration DHVQFN24.
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
index area
terminal 1
MR
D0
D1
D2
D3
D4
D5
D6
D7
D8
10
11
2
3
4
5
6
7
8
9
Transparent top view
GND
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
(1)
823
74LVC823A
23
22
21
20
19
18
17
16
15
14
001aaa846
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
CE
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