upd78p058f Renesas Electronics Corporation., upd78p058f Datasheet - Page 66

• Manufacturer Part Number: upd78p058f
• Description: Mos Intergrated Circuit, 8-bit Single-chip Microcontroller
• Manufacturer: Renesas Electronics Corporation.

66
(2) PD78P058FGC-8BT : 80-pin plastic QFP (14
Note
Caution
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin partial heating
The number of days for storage after the dry pack has been opened. Storage conditions are 25 C and 65%
RH max.
Use of more than one soldering method should be avoided (except the pin partial heating method).
Package peak temperature: 235 C, Reflow time: 30 seconds or below (210 C or
higher), Number of reflow processes: 2 max., Exposure limit: 7 days
prebaking is necessary at 125 C for 10 hours)
Package peak temperature: 215 C, Reflow time: 40 seconds or below (200 C or
higher), Number of reflow processes: 2 max., Exposure limit: 7 days
prebaking is necessary at 125 C for 10 hours)
Solder temperature: 260 C or below, Flow time: 10 seconds or below, Number of flow
processes: 1, Preheating temperature: 120 C or below (package surface tempera-
ture), Exposure limit: 7 days
hours)
Pin temperature: 300 C or below, Time: 3 seconds or below (per side of device)
Table 9-1. Surface Mount Type Soldering Conditions (2/2)
Note
Soldering Conditions
(after that, prebaking is necessary at 125 C for 10
14 mm, Resin thickness: 1.4 mm)
Note
Note
(after that,
(after that,
IR35-107-2
VP15-107-2
WS60-107-1
Symbol
—
PD78P058F