upd78p058f Renesas Electronics Corporation., upd78p058f Datasheet - Page 65

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upd78p058f

Manufacturer Part Number
upd78p058f
Description
Mos Intergrated Circuit, 8-bit Single-chip Microcontroller
Manufacturer
Renesas Electronics Corporation.
Datasheet

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9. RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual (C10535E).
tative.
(1) PD78P058FGC-3B9 : 80-pin plastic QFP (14
Note
Caution
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin partial heating
The PD78P058F should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document Semiconductor Device
For soldering methods and conditions other than those recommended, please contact your NEC sales represen-
The number of days for storage after the dry pack has been opened. Storage conditions are 25 C and 65%
RH max.
Use of more than one soldering method should be avoided (except the pin partial heating method).
Package peak temperature: 235 C, Reflow time: 30 seconds or below (210 C or
higher), Number of reflow processes: 3 max., Exposure limit: 7 days
prebaking is necessary at 125 C for 20 hours)
Package peak temperature: 215 C, Reflow time: 40 seconds or below (200 C or
higher), Number of reflow processes: 3 max., Exposure limit: 7 days
prebaking is necessary at 125 C for 20 hours)
Solder temperature: 260 C or below, Flow time: 10 seconds or below, Number of flow
processes: 1, Preheating temperature: 120 C or below (package surface tempera-
ture), Exposure limit: 7 days
hours)
Pin temperature: 300 C or below, Time: 3 seconds or below (per side of device)
Table 9-1. Surface Mount Type Soldering Conditions (1/2)
Note
Soldering Conditions
(after that, prebaking is necessary at 125 C for 20
14 mm, Resin thickness: 2.7 mm)
Note
Note
(after that,
(after that,
IR35-207-3
VP15-207-3
WS60-207-1
PD78P058F
Symbol
65

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