mtd12n06ezl ON Semiconductor, mtd12n06ezl Datasheet - Page 7

• Manufacturer Part Number: mtd12n06ezl
• Description: Tmos Power Fet 12 Amperes 60 Volts
• Manufacturer: ON Semiconductor

design. The footprint for the semiconductor packages must be
the correct size to ensure proper solder connection interface
function of the drain pad size. These can vary from the
minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a surface
mount device is determined by T
junction temperature of the die, R
from the device junction to ambient, and the operating
temperature, T
P
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T
calculate the power dissipation of the device. For a DPAK
device, P
the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 1.75 Watts. There are
other alternatives to achieving higher power dissipation from
the surface mount packages. One is to increase the area of the
drain pad. By increasing the area of the drain pad, the power
D
Motorola TMOS Power MOSFET Transistor Device Data
Surface mount board layout is a critical portion of the total
The power dissipation for a surface mount device is a
The values for the equation are found in the maximum
The 71.4 C/W for the DPAK package assumes the use of
can be calculated as follows:
D
is calculated as follows.
INFORMATION FOR USING THE DPAK SURFACE MOUNT PACKAGE
P
A
. Using the values provided on the data sheet,
D
P
= 150 C − 25 C
D
RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
=
71.4 C/W
T
J(max)
R
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
JA
− T
J(max)
JA
= 1.75 Watts
A
, the thermal resistance
, the maximum rated
0.190
4.826
A
of 25 C, one can
0.165
4.191
0.100
2.54
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
dissipation can be increased. Although one can almost double
the power dissipation with this method, one will be giving up
area on the printed circuit board which can defeat the purpose
of using surface mount technology. For example, a graph of
R
an aluminum core board such as Thermal Clad . Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
Another alternative would be to use a ceramic substrate or
JA
100
0.118
80
60
40
20
3.0
versus drain pad area is shown in Figure 15.
0
Figure 15. Thermal Resistance versus Drain Pad
0.063
1.6
Area for the DPAK Package (Typical)
0.243
6.172
inches
mm
2
1.75 Watts
A, AREA (SQUARE INCHES)
3.0 Watts
4
5.0 Watts
Board Material = 0.0625
G−10/FR−4, 2 oz Copper
6
T
8
A
= 25 C
7
10