ntd4856n ON Semiconductor, ntd4856n Datasheet
ntd4856n
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ntd4856n Summary of contents
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... CASE 369AC CASE 369D 3 IPAK IPAK (Straight Lead) (Straight Lead DPAK) MARKING DIAGRAMS & PIN ASSIGNMENTS 4 Drain 4 Drain Gate Drain Source Source Gate Drain Source Y = Year WW = Work Week 4856N = Device Code G = Pb-Free Package ORDERING INFORMATION Publication Order Number: NTD4856N/D ...
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... Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. NTD4856N (T = 25°C unless otherwise specified) J Symbol Test Condition = 250 ...
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... Reverse Recovery Charge PACKAGE PARASITIC VALUES Source Inductance Drain Inductance, DPAK Drain Inductance, IPAK Gate Inductance Gate Resistance 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. NTD4856N (T = 25°C unless otherwise specified) J Symbol Test Condition ...
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... GATE-TO-SOURCE VOLTAGE (VOLTS) GS Figure 3. On-Resistance vs. Gate-to-Source Voltage 1 1 1.4 1.2 1.0 0.8 0.6 -50 - JUNCTION TEMPERATURE (°C) J Figure 5. On-Resistance Variation with Temperature NTD4856N 130 ≥ 120 T = 25° 110 3.6 V 100 ...
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... SINGLE PULSE T = 25° LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN-TO-SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTD4856N TYPICAL PERFORMANCE CURVES 25° Figure 8. Gate-To-Source and Drain-To-Source ...
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... ORDERING INFORMATION Device NTD4856NT4G NTD4856N-1G NTD4856N-35G IPAK Trimmed Lead †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD4856N TYPICAL PERFORMANCE CURVES P (pk DUTY CYCLE 1.0E-03 1.0E-02 t, TIME (ms) Figure 13 ...
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... 0.13 (0.005) M *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD4856N PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369AA-01 ISSUE A SEATING -T- PLANE SOLDERING FOOTPRINT* 6 ...
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... BSC 2.29 BSC G H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 --- 3.93 --- STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTD4856N/D ...