ESDA6V1-4F1 STMicroelectronics, ESDA6V1-4F1 Datasheet - Page 5

• Manufacturer Part Number: ESDA6V1-4F1
• Description: QUAD TRANSIL ARRAY
• Manufacturer: STMicroelectronics

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The ESDA6V1-4F1 array is the ideal product for use as board level protection of ESD sensitive
semiconductor components.
The Flip Chip package makes the ESDA6V1-4F1 device some of the smallest ESD protection devices
available. It also allows design flexibility in the design of “crowded” boards where the space saving is at a
premium. This enables to shorten the routing and can contribute to improved ESD performance.
LAYOUT RECOMMENDATIONS
Circuit board layout is a critical design step in the suppression of ESD induced transients. The following
guidelines are recommended :
The ESDA6V1-4F1 should be placed as close as possible to the input terminals or connectors.
Minimise the path length between the ESD suppressor and the protected device
Minimise all conductive loops, including power and ground loops
The ESD transient return path to ground should be kept as short as possible.
Use ground planes whenever possible.
Ø =320µm max (stencil aperture)
Solder paste
Stencil Design
thickness of 150µm
Copper Pad
Cu - Ni (2-6µm) - Au (0.2µm max)
= 250µm (300µm max)
500µm
ESDA6V1-4F1
500µm
Ø =340µm min (for 300µm
Non Solder mask opening
ESDA6V1-4F1
pad
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