ESDA14V2-1BF3 ST Microelectronics, ESDA14V2-1BF3 Datasheet - Page 7

• Manufacturer Part Number: ESDA14V2-1BF3
• Description: TVS Clamping Array
• Manufacturer: ST Microelectronics

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ESDA14V2-1BF3
4.2
Assembly
For chip scale package mounting on the PCB, STMicroelectronics recommends the use of a
solder stencil aperture of 330 x 330 µm² maximum and a typical stencil thickness of 75 or
80 µm. Chip scale packages are fully compatible with the use of near eutectic 95.5 Sn, 4 Ag,
0.5 Cu solder paste with no-clean flux. ST's recommendations for chip scale package board
mounting are illustrated on the soldering reflow profile shown in
Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Dwell time in the soldering zone (with temperature higher than 220 °C) has to be kept as
short as possible to prevent component and substrate damages. Peak temperature must not
exceed 260 °C. Controlled atmosphere (N2 or N2H2) is recommended during the whole
reflow, especially above 150 °C.
Chip scale packages are able to withstand three times the previous recommended reflow
profile in order to be compatible with a double reflow when SMDs are mounted on both sides
of the PCB and one additional repair.
A maximum of three soldering reflows are allowed for these lead-free packages (with repair
step included).
The use of a no-clean flux is highly recommended to avoid any cleaning operation. To
prevent any bump cracks, ultrasonic cleaning methods are not recommended.
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
1
1
Doc ID 15894 Rev 1
90 to 150 sec
90 to 150 sec
2
2
3
3
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
5
5
Figure
2°C/s recommended
PCB recommendations
6
6
6°C/s max
2°C/s recommended
15.
6°C/s max
Time (min)
Time (min)
7
7
7/9