ESDA14V2-1BF3 ST Microelectronics, ESDA14V2-1BF3 Datasheet
ESDA14V2-1BF3
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ESDA14V2-1BF3 Summary of contents
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... Printers ■ Communications systems and cellular phones ■ Video equipment Description The ESDA14V2-1BF3 is a monolithic bidirectional diode designed to protect 1 line against ESD transients. The device is ideally suited for applications where both reduced line capacitance and board space saving are required. June 2009 ...
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... Leakage current @ V RM Dynamic resistance Voltage - temperature coefficient Line capacitance = 25 °C) amb Test condition = 2.5 µ ° (25 ° osc Doc ID 15894 Rev 1 ESDA14V2-1BF3 Value ±15 ± initial amb 125 - 55 to +150 260 -40 to +125 Min. Typ. Max 14 ...
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... ESDA14V2-1BF3 Figure 3. Relative variation of peak pulse power versus initial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Figure 5. Clamping voltage versus peak pulse current (square pulse, typical values) 10.0 Square wave 2.5µs - T=25°C 1.0 0 Figure 7. Relative variation of leakage current versus junction temperature (typical values) 1000 ...
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... Ordering information scheme Figure 11. Ordering information scheme ESD array Breakdown voltage 14V2 = 14.2 Volts min. Number of lines line Type B = Bidirectional Package F = Flip Chip 4/9 Figure 10. ESD response to IEC61000-4-2 (-15 kV air discharge) 20 V/div -79 V 100 ns/div ESDA 14V2 Doc ID 15894 Rev 1 ESDA14V2-1BF3 100 ns/div - ...
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... ESDA14V2-1BF3 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK Figure 12. Package dimensions Figure 13. Flip Chip tape and reel specification All dimensions in mm packages, depending on their level of environmental compliance. ECOPACK trademark. 0.69 mm ± ...
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... Micro via SBU to be avoided – Micro via SBU filled (under qualification) Cu – Ni (2-6 µ (0.2 µm max) Figure 450 µm 370 µm 255 µm 180 µm 100 µm Non solder mask defined Doc ID 15894 Rev 1 ESDA14V2-1BF3 Table 3. 14) 370 µm 180 µm Solder mask defined ...
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... ESDA14V2-1BF3 4.2 Assembly For chip scale package mounting on the PCB, STMicroelectronics recommends the use of a solder stencil aperture of 330 x 330 µm² maximum and a typical stencil thickness µm. Chip scale packages are fully compatible with the use of near eutectic 95.5 Sn, 4 Ag, ...
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... Ordering information 5 Ordering information Table 4. Order code ESDA14V2-1BF3 6 Revision history Table 5. Date 25-Jun-2009 8/9 Ordering information Marking Package None Flip Chip Document revision history Revision 1 Initial release. Doc ID 15894 Rev 1 ESDA14V2-1BF3 Weight Base qty Delivery mode 0. 000 Tape and reel 7” Changes ...
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... ESDA14V2-1BF3 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...