SC18IS601 Philips Semiconductors, SC18IS601 Datasheet - Page 25

• Manufacturer Part Number: SC18IS601
• Description: (SC18IS600 / SC18IS601) SPI to IC-bus interface
• Manufacturer: Philips Semiconductors

NXP Semiconductors
12. Abbreviations
SC18IS600_601_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 17.
Acronym
ASCII
GPIO
UART
LSB
MSB
I
SPI
2
Fig 28. Temperature profiles for large and small components
C-bus
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
American Standard Code for Information Interchange
General Purpose Input/Output
Universal Asynchronous Receiver/Transmitter
Least Significant Bit
Most Significant Bit
Inter IC bus
Serial Peripheral Interface
Rev. 03 — 13 December 2006
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SC18IS600/601
temperature
SPI to I
peak
© NXP B.V. 2006. All rights reserved.
2
C-bus interface
001aac844
time
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