LTC6257 Linear Technology, LTC6257 Datasheet - Page 18

• Manufacturer Part Number: LTC6257
• Description: 65uA Power Efficient Rail-to-Rail I/O Op Amps
• Manufacturer: Linear Technology

pAckAge Description
LTC6255/LTC6256/LTC6257

2.55 ±0.05
1.15 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.64 ±0.05
1.37 ±0.05
1.35 REF
0.45 BSC
0.70 ±0.05
0.25 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
PACKAGE
OUTLINE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(Reference LTC DWG # 05-08-1749 Rev Ø)
8-Lead Plastic UTDFN (2mm × 2mm)
(SEE NOTE 6)
TOP MARK
PIN 1 BAR
0.125 REF
KC Package
2.00 ±0.10
0.55 ±0.05
2.00 ±0.10
0.00 – 0.05
R = 0.05
0.64 ± 0.10
TYP
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
4
5
1.37 ± 0.10
1.35 REF
www.DataSheet4U.com
0.45 BSC
8
1
(KC8) UTDFN 0107 REVØ
0.40 ± 0.10
0.23 ± 0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 45°
CHAMFER
625567f