LTC4413-2 Linear Technology, LTC4413-2 Datasheet - Page 15

• Manufacturer Part Number: LTC4413-2
• Description: Fast Ideal Diodes
• Manufacturer: Linear Technology

PACKAGE DESCRIPTION
3.50 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TOP MARK
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
10-Lead Plastic DFN (3mm × 3mm)
2.38 ±0.05
(2 SIDES)
(Reference LTC DWG # 05-08-1699)
0.50
BSC
DD Package
0.675 ±0.05
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
LTC4413-1/LTC4413-2
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD) DFN 1103
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