LTC2223 Linear Technology, LTC2223 Datasheet - Page 27

• Manufacturer Part Number: LTC2223
• Description: (LTC2222 / LTC2223) 105Msps/80Msps ADCs
• Manufacturer: Linear Technology

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PACKAGE DESCRIPTIO
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
7.00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
0.50 BSC
0.25 ±0.05
48-Lead Plastic QFN (7mm × 7mm)
(Reference LTC DWG # 05-08-1704)
0.70 ±0.05
5.15 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.75 ± 0.05
UK Package
6.10 ±0.05 7.50 ±0.05
5.15 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
R = 0.115
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1
OUTLINE MO-220 VARIATION (WKKD-2)
OF PACKAGE DO NOT INCLUDE MOLD FLASH.
MOLD FLASH, IF PRESENT, SHALL NOT EXCEED
0.20mm ON ANY SIDE, IF PRESENT
LOCATION ON THE TOP AND BOTTOM OF PACKAGE
TYP
BOTTOM VIEW—EXPOSED PAD
LTC2222/LTC2223
CHAMFER
0.50 BSC
0.25 ± 0.05
PIN 1
47
48
(UK48) QFN 0903
0.40 ± 0.10
1
2
27
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