ST62T35B ST Microelectronics, ST62T35B Datasheet - Page 67

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ST62T35B

Manufacturer Part Number
ST62T35B
Description
(ST62E35B / ST62T35B) 8-BIT OTP/EPROM MCUs
Manufacturer
ST Microelectronics
Datasheet
6 ELECTRICAL CHARACTERISTICS
6.1 ABSOLUTE MAXIMUM RATINGS
This product contains devices to protect the inputs
against damage due to high static voltages, how-
ever it is advisable to take normal precaution to
avoid application of any voltage higher than the
specified maximum rated voltages.
For proper operation it is recommended that V
and V
Reliability is enhanced if unused inputs are con-
nected to an appropriate logic voltage level (V
or V
Notes:
- Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and
- (1) Within these limits, clamping diodes are guarantee to be not conductive. Voltages outside these limits are authorised as long as injection
functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended period s may
affect device reliability.
current is kept within the specification.
SS
Symbol
T
O
IV
IV
).
V
V
STG
V
I
Tj
DD
O
DD
SS
O
be higher than V
I
Supply Voltage
Input Voltage
Output Voltage
Current Drain per Pin Excluding V
Total Current into V
Total Current out of V
Junction Temperature
Storage Temperature
SS
and lower than V
DD
Parameter
SS
(source)
(sink)
DD
DD
DD
.
I
, V
SS
Power Considerations.The average chip-junc-
tion temperature, Tj, in Celsius can be obtained
from:
Where:TA = Ambient Temperature.
Tj=TA + PD x RthJA
RthJA =Package thermal resistance(junc-
PD = Pint + Pport.
Pint =IDD x VDD (chip internal power).
Pport =Port power dissipation (determined
V
V
SS
SS
tion-to ambient).
by the user).
- 0.3 to V
- 0.3 to V
-0.3 to 7.0
-60 to 150
Value
150
50
50
10
DD
DD
+ 0.3
+ 0.3
ST62T35B/E35B
(1)
(1)
Unit
mA
mA
mA
V
V
V
C
C
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