DIM800NSM33-F000 Dynex Semiconductor, DIM800NSM33-F000 Datasheet - Page 8

• Manufacturer Part Number: DIM800NSM33-F000
• Description: Single Switch IGBT Module
• Manufacturer: Dynex Semiconductor

DIM800NSM33-F000
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the
basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances
in device voltages and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in
general use today. The Assembly group offers high quality engineering support dedicated to designing new units
to satisfy the growing needs of our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly
Complete Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been
designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and
liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales
representative or Customer Services.
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hand corner of the front page, to indicate product status.
The annotations are as follows:-
Target Information:
Preliminary Information:
Advance Information:
No Annotation:
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or
contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance
or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning
possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s
responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been
superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold
and services provided subject to the Company’s conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN THE UK
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
HEADQUARTERS & OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln
Lincolnshire, LN6 3LF. United Kingdom.
Fax: [phone]
Tel: [phone]
This is the most tentative form of information and represents a very preliminary specification. No actual d
work on the product has been started
The product is in design and development. The datasheet represents the product as it is understood but
may change.
The product design is complete and final characterisation for volume production is well in hand.
The product parameters are fixed and the product is available to datasheet specification.
CUSTOMER SERVICE
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln
Lincolnshire, LN6 3LF. United Kingdom.
Fax: [phone]
Tel: [phone] / 502901
e-mail: [e-mail]
http://www.dynexsemi.com
www.dynexsemi.com
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