PBSS306NX Philips Semiconductors, PBSS306NX Datasheet - Page 11

• Manufacturer Part Number: PBSS306NX
• Description: NPN low VCEsat (BISS) transistor
• Manufacturer: Philips Semiconductors

Philips Semiconductors
11. Soldering
PBSS306NX_1
Product data sheet
Fig 16. Reflow soldering footprint
Fig 17. Wave soldering footprint
4.60
0.85
SOT89 standard mounting conditions for reflow soldering
Dimensions in mm
Not recommended for wave soldering
Dimensions in mm
1.20
1.20
1.00
(3x)
0.20
1.50
3
0.70
5.30
2.40
6.60
Rev. 01 — 21 August 2006
3
1.20
3.70
3.95
4.75
2.25
2.00
1.90
2
1
2
0.50
100 V, 4.5 A NPN low V
1.20
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
1.20
1.70
transport direction during soldering
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
4.85
msa442
PBSS306NX
CEsat
solder lands
solder resist
occupied area
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
MSA423
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