MD4811-d512-MECH-P M-Systems, MD4811-d512-MECH-P Datasheet
MD4811-d512-MECH-P
Manufacturer Part Number
MD4811-d512-MECH-P
Description
DiskOnChip-Based MCP Including Mobile DiskOnChip G3 and Mobile RAM
Manufacturer
M-Systems
Datasheet
1.MD4811-D512-MECH-P.pdf
(171 pages)
Highlights
DiskOnChip-based MCP (Multi-Chip Package)
is a complete memory solution. Efficiently
packed in a small Fine-Pitch Ball Grid Array
(FBGA) package, it is ideal for data and code
storage inside 2.5G and 3G mobile handsets and
Personal Digital Assistants (PDAs).
DiskOnChip-based MCP consists of:
Using such an MCP configuration reduces
overall memory costs, saves PCB real estate
and maintains efficient power consumption
levels. It may also have far-reaching
implications on the mobile handset memory
architecture, supporting a NOR-less memory
system by providing boot functionality at a
much less expensive cost than NOR.
General Features
1
M-Systems’ Mobile DiskOnChip G3
Elpida’s Mobile RAM (SDRAM)
Small 9x12x1.3 mm 107-ball FBGA
package
512Mbit (64MByte) Mobile DiskOnChip
G3
128Mbit (16Mbyte) Mobile RAM
(SDRAM)
High performance 16-bit interface to all
devices
Deep Power-Down mode for low power
consumption
Operating voltage
DiskOnChip: 2.5V to 3.6V
Mobile RAM: 1.8V ± 0.15V
Operating temperature: -25°C to +85°C
Including Mobile DiskOnChip G3 and Mobile RAM
DiskOnChip
Data Sheet, Rev. 0.2
®
-Based MCP
Mobile DiskOnChip G3
Highlights
Mobile DiskOnChip G3 is one of the industry’s
most efficient storage solutions, using
Toshiba’s 0.13 micron Multi-Level Cell (MLC)
NAND flash technology and x2 technology
from M-Systems. MLC NAND flash
technology provides the smallest die size by
storing 2 bits of information in a single memory
cell. x2 technology enables MLC NAND to
achieve highly reliable, high-performance data
and code storage with a specially designed error
detection and correction mechanism, optimized
file management, and proprietary algorithms for
enhanced performance.
Further cost benefits derive from the
cost-effective architecture of Mobile
DiskOnChip G3, which includes a boot block
that can replace expensive NOR flash, and
incorporates both the flash array and an
embedded thin controller in a single die.
Mobile DiskOnChip G3 provides:
Flash disk for both code and data storage
Low voltage: 1.8V or 3.3 I/O (auto-detect),
3V Core
Hardware protection and security-enabling
features
Data Sheet, February 2004
97-DT-0803-00
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