MT8VDDT3264HG-26A Micron, MT8VDDT3264HG-26A Datasheet

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MT8VDDT3264HG-26A

Manufacturer Part Number
MT8VDDT3264HG-26A
Description
256MB (x64) 200-PIN DDR SDRAM SODIMM
Manufacturer
Micron
Datasheet
SMALL-OUTLINE
DDR SDRAM MODULE
FEATURES
• 200-pin small-outline dual in-line memory module
• Fast data transfer rates PC2100 or PC1600
• Utilizes 200 Mb/s/pin and 266 Mb/s/pin DDR
• 128MB (16 Meg x 64) and 256MB (32 Meg x 64)
• V
• V
• 2.5V I/O (SSTL_2 compatible)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
• Internal, pipelined double data rate (DDR) architec-
• Bidirectional data strobe (DQS) transmitted/
• Differential clock inputs (CK and CK# - can be
• Four internal device banks for concurrent operation
• Programmable burst lengths: 2, 4, or 8
• Auto precharge option
• Auto Refresh and Self Refresh Modes
• 15.6µs (MT8VDDT1664HG), 7.8125µs
• Serial Presence Detect (SPD) with EEPROM
• Programmable READ CAS latency
• Gold-plated edge contacts
PART NUMBERS AND TIMING PARAMETERS
NOTE: All part numbers end with a two-place code (not shown), designating component and PCB revisions. Consult factory for
16, 32 Meg x 64 200-Pin DDR SDRAM SODIMMs
DD8C16_32X64HG_A.p65 – Rev. A; Pub. 11/01
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PUROPOSES ONLY AND ARE SUBJECT TO CHANGE BY
PART NUMBER
MT8VDDT1664HG-26A__
MT8VDDT1664HG-265__
MT8VDDT1664HG-202__
MT8VDDT3264HG-26A__
MT8VDDT3264HG-265__
MT8VDDT3264HG-202__
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON'S PRODUCTION AND DATA SHEET SPECIFICATIONS.
(SODIMM)
SDRAM components
aligned with data for WRITEs
ture; two data accesses per clock cycle
received with data—i.e., source-synchronous data
capture
multiple clocks, CK0/CK0#, CK1/CK1#, etc.)
(MT8VDDT3264HG) maximum average periodic
refresh interval
DD
DDSPD
current revision codes. Example: MT8VDDT3264HG-265A1
= V
= +2.2V to +5.5V
DD
Q = +2.5V ±0.2V
MARKING
PART
-26A
-26A
-265
-202
-265
-202
MODULE
DENSITY
128MB
128MB
128MB
256MB
256MB
256MB
CONFIGURATION
16 Meg x 64
16 Meg x 64
16 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
1
MT8VDDT1664HG
MT8VDDT3264HG
For the latest data sheet, please refer to the Micron Web
site:
OPTIONS
• Package
• Frequency/CAS Latency
ADDRESS TABLE
Refresh Count
Row Addressing
Device Bank Addressing
Device Configuration
Column Addressing
Module Bank Addressing
200-PIN DDR SDRAM SODIMMs
200-pin SODIMM (gold)
133 MHz (266 Mb/s/pin/CL = 2)
133 MHz (266 Mb/s/pin/CL = 2.5)
100 MHz (200 Mb/s/pin/CL = 2)
www.micron.com/datasheets
TRANSFER
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2.1 GB/s
2.1 GB/s
1.6 GB/s
2.1 GB/s
2.1 GB/s
1.6 GB/s
RATE
200-Pin SODIMM
CLOCK/DATA RATE
7.5ns/266 Mb/s/pin
7.5ns/266 Mb/s/pin
7.5ns/266 Mb/s/pin
7.5ns/266 Mb/s/pin
10ns/200 Mb/s/pin
10ns/200 Mb/s/pin
128MB, 256MB (x64)
MEMORY BIT
MO-224
4 (BA0, BA1)
4K (A0–A11)
1K (A0–A9)
16 Meg x 8
-
-
1 (S0#)
128MB
4K
128MB
256MB
(CL -
©2001, Micron Technology, Inc.
ADVANCE
LATENCY
MARKING
4 (BA0, BA1)
8K (A0–A12)
1K (A0–A9)
32 Meg x 8
2.5-3-3
2.5-3-3
t
RCD -
2-3-3
2-2-2
2-3-3
2-2-2
1 (S0#)
256MB
8K
-26A
-265
-202
G
t
RP)

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