MTP3N50E Motorola, MTP3N50E Datasheet

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MTP3N50E

Manufacturer Part Number
MTP3N50E
Description
TMOS POWER FET 3.0 AMPERES 500 VOLTS RDS
Manufacturer
Motorola
Datasheet

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Part Number:
MTP3N50E
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MOT/ON
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12 500
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Designer's
TMOS
High Energy Power FET
N–Channel Enhancement–Mode Silicon Gate
withstand high energy in the avalanche mode and switch efficiently.
This new high energy device also offers a drain–to–source diode
with fast recovery time. Designed for high voltage, high speed
switching applications such as power supplies, PWM motor
controls and other inductive loads, the avalanche energy capability
is specified to eliminate the guesswork in designs where inductive
loads are switched and offer additional safety margin against
unexpected voltage transients.
(1) V DD = 50 V, I D = 3.0 A
(2) Pulse Width and frequency is limited by T J (max) and thermal response
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
MAXIMUM RATINGS
UNCLAMPED DRAIN–TO–SOURCE AVALANCHE CHARACTERISTICS
THERMAL CHARACTERISTICS
Motorola TMOS Power MOSFET Transistor Device Data
Motorola, Inc. 1996
Drain–Source Voltage
Drain–Gate Voltage (R GS = 1.0 M )
Gate–Source Voltage — Continuous
Gate–Source Voltage
Drain Current — Continuous
Drain Current
Total Power Dissipation @ T C = 25 C
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — T J = 25 C
Single Pulse Drain–to–Source Avalanche Energy
Repetitive Pulse Drain–to–Source Avalanche Energy
Thermal Resistance — Junction to Case
Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
This advanced high voltage TMOS E–FET is designed to
Avalanche Energy Capability Specified at Elevated
Temperature
Low Stored Gate Charge for Efficient Switching
Internal Source–to–Drain Diode Designed to Replace External
Zener Transient Suppressor — Absorbs High Energy in the
Avalanche Mode
Source–to–Drain Diode Recovery Time Comparable to Discrete
Fast Recovery Diode
Derate above 25 C
— Pulsed
E-FET.
— Junction to Ambient
— Non–repetitive (t p
(T C = 25 C unless otherwise noted)
Data Sheet
Rating
50 s)
— T J = 100 C
G
(T J < 150 C)
D
S
W DSR (1)
W DSR (2)
Symbol
T J , T stg
V GSM
V DGR
V DSS
R JC
R JA
V GS
I DM
P D
T L
I D
MTP3N50E
R DS(on) = 3.0 OHMS
CASE 221A–06, Style 5
TMOS POWER FET
Motorola Preferred Device
– 65 to 150
3.0 AMPERES
Value
500 VOLTS
62.5
500
500
210
260
3.0
0.4
5.0
2.5
TO–220AB
10
50
33
20
40
Order this document
by MTP3N50E/D
Watts
W/ C
Unit
Vdc
Vdc
Vdc
Vpk
Adc
C/W
mJ
C
C
1

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MTP3N50E Summary of contents

Page 1

... Preferred devices are Motorola recommended choices for future use and best overall value. REV 1 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1996 < 150 C) — 100 C Order this document by MTP3N50E/D MTP3N50E Motorola Preferred Device TMOS POWER FET 3.0 AMPERES 500 VOLTS R DS(on) = 3.0 OHMS S CASE 221A–06, Style 5 TO–220AB ...

Page 2

... MTP3N50E ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( 0.25 mA) Zero Gate Voltage Drain Current ( 500 400 125 C) Gate–Body Leakage Current, Forward (V GSF = 20 Vdc Gate– ...

Page 3

... Figure 4. Breakdown Voltage Variation 2 1 1 –50 –25 Figure 6. On–Resistance versus Temperature MTP3N50E 0. 100 125 150 JUNCTION TEMPERATURE ( C) With Temperature 0 50 100 150 JUNCTION TEMPERATURE ( C) With Temperature 0 25 ...

Page 4

... MTP3N50E SAFE OPERATING AREA INFORMATION SINGLE PULSE 0.1 R DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0. 100 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 7. Maximum Rated Forward Biased Safe Operating Area FORWARD BIASED SAFE OPERATING AREA The FBSOA curves define the maximum drain–to–source voltage and drain current that a device can safely handle when it is forward biased, or when it is on, or being turned on ...

Page 5

... Figure 11. Commutating Waveforms – Figure 13. Commutating Safe Operating Area 500 600 V (BR)DSS 4700 F 250 Figure 15. Unclamped Inductive Switching MTP3N50E DS(pk /dt V dsL MAX. CSOA STRESS AREA R GS DUT – ...

Page 6

... MTP3N50E 1000 800 600 400 C rss 200 GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 16. Capacitance Variation 2N3904 100 PULSE WIDTH 100 s, DUTY CYCLE 10 ...

Page 7

... T S STYLE 5: U PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN R J CASE 221A–06 ISSUE Y MTP3N50E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. INCHES MILLIMETERS DIM MIN MAX ...

Page 8

... JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 *MTP3N50E/D* Motorola TMOS Power MOSFET Transistor Device Data MTP3N50E/D ...

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