BUK7830-30 Philips Semiconductors, BUK7830-30 Datasheet
BUK7830-30
Related parts for BUK7830-30
BUK7830-30 Summary of contents
Page 1
... T = 100 ˚ 100 ˚C amb ˚ ˚C amb ˚ ˚C amb - CONDITIONS Mounted on any PCB Mounted on PCB of Fig.19 1 Product specification BUK7830-30 MAX. UNIT ˚C 12 ˚C 5.9 amb 8.3 150 SYMBOL MIN. MAX. UNIT - ...
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... GS G Resistive load Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad 2 Product specification BUK7830-30 MIN. MAX. UNIT - 2 kV MIN. TYP. MAX. UNIT 30 ...
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... 5.9 A; -dI /dt = 100 - CONDITIONS ˚ Product specification BUK7830-30 MIN. TYP. MAX. UNIT - - 6 24 0. 115 - MIN. TYP. MAX. UNIT - - 60 mJ Rev 1 ...
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... Fig.6. Typical on-state resistance Product specification BUK7830-30 Zth j-amb / (K/ 0.5 0.2 0.1 0.05 0. 1E-07 1E-05 1E-03 1E-01 1E+ Fig.4. Transient thermal impedance f(t); parameter j-mb p BUK7830- VGS / VDS / f(V ); parameter 6.5 VGS / f(I ); parameter V DS(ON BUKX83 ...
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... 10000 1000 100 100 150 Fig.12. Typical capacitances 3 f Product specification BUK7830-30 VGS(TO max. typ. min. - 100 Fig.10. Gate threshold voltage. = f(T ); conditions mA; V GS(TO Sub-Threshold Conduction 2% typ Fig.11. Sub-threshold drain current. ...
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... Fig.15. Normalised avalanche energy rating DSS 7830-30 VGS 0 1.5 2 Fig.16. Avalanche energy test circuit VGS 0 6 Product specification BUK7830- 100 120 140 Tmb / f(T ); conditions 5 VDS - T.U. RGS shunt 2 0 DSS ...
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... Philips Semiconductors TrenchMOS transistor Standard level FET MOUNTING INSTRUCTIONS Fig.18. soldering pattern for surface mounting SOT223. PRINTED CIRCUIT BOARD December 1997 3.8 min 1.5 min 2.3 6.3 1.5 min (3x) 1.5 min 4.6 7 Product specification BUK7830-30 Dimensions in mm. Rev 1.100 ...
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... Philips Semiconductors TrenchMOS transistor Standard level FET Fig.19. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick). December 1997 Product specification BUK7830-30 Dimensions in mm. 18 4.5 Rev 1.100 ...
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... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to surface mounting instructions for SOT223 envelope. 3. Epoxy meets UL94 V0 at 1/8". December 1997 3.1 0.32 0.24 2.9 0.10 0. max 1.05 1.8 2.3 max 0.85 Fig.20. SOT223 surface mounting package. 9 Product specification BUK7830-30 6.7 6 3.7 7.3 6.7 3 0.80 M 0.1 B 0.60 (4x) 4.6 0 Rev 1.100 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. December 1997 10 Product specification BUK7830-30 Rev 1.100 ...