SM6HTXXA STMicroelectronics, SM6HTXXA Datasheet
SM6HTXXA
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SM6HTXXA Summary of contents
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... Junction to ambient on printed circuit. th (j-a) On recommended pad layout April 1999 Ed: 4A HIGH TEMPERATURE TRANSIL FOR AUTOMOTIVE APPLICATIONS = 25°C) amb Parameter Tj initial = T T amb = tp = 10ms Tj initial = T Parameter SM6HTxxA SMB (JEDEC D0-214AA) Value Unit 600 amb amb - 65 to 175 260 Value Unit ...
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... SM6HTxxA ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) amb Symbol Parameter V Stand-off voltage RM V Breakdown voltage BR V Clamping voltage CL I Leakage current @ Peak pulse current PP V Forward voltage drop F V < 3. (pulse test: tp 500 s) Types Marking Tamb=25°C Tamb=150°C ...
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... Fig. 5: Peak forward voltage drop versus peak for- ward current (typical values). 100.0 F=1MHz 10.0 SM6HT24A SM6HT27A 1.0 SM6HT30A SM6HT36A SM6HT39A SM6HT43A 0.1 0.5 100 200 Rth(j-a)=100°C/W Tamb(° 100 125 SM6HT30A SM6HT27A SM6HT24A tp=1ms Vcl(V) IFM(A) Tj=175°C Tj=25°C VFM(V) 1.0 1.5 2.0 2.5 SM6HTxxA 150 175 SM6HT36A SM6HT39A tp=20µs SM6HT43A 100 3.0 3.5 3/5 ...
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... SM6HTxxA Fig. 6: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4 with recommended pad layout). Zth(j-a)(°C/W) 1E+2 1E+1 1E+0 tp(s) 1E-1 1E-3 1E-2 1E-1 1E+0 Fig .8: Variation of leakage current versus junction temperature (typical values). IR(µA) 1E+4 1E+3 1E+2 1E+1 1E+0 1E-1 1E-2 1E-3 Tj(°C) 1E 100 4/5 Fig. 7: Thermal resistance junction to ambient ver- sus copper surface under each lead (printed circuit board FR4, e(Cu)=35 m). Rth(j-a) (° ...
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... Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. REF 2.3 STMicroelectronics GROUP OF COMPANIES http://www.st.com SM6HTxxA DIMENSIONS Millimeters Inches Min. Max. Min. Max. 1.90 2.45 0.075 0.096 0.05 0.20 0.002 0.008 1.95 2 ...