AN1850 Freescale Semiconductor / Motorola, AN1850 Datasheet - Page 2

• Manufacturer Part Number: AN1850
• Description: Flip-Chip PBGA Package Construction Assembly and Board-Level Reliability
• Manufacturer: Freescale Semiconductor / Motorola

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General Package Information
Substrate dielectric material
Substrate CTE (ppm/°C)
Solder ball composition (weight %)
Solder ball diameter (mm)
Package solder pad diameter (mm)
Package solder pad type
Entire solder ball reßows during assembly
Solder ball liquidus (°C)
Solder ball solidus (°C)
Recommended motherboard solde pad solderable
surface diameter (mm)
Optional motherboard solder pad solderable surface
diameter (mm)
Note: Use of this pad is acceptable, but may result in
slightly reduced board-level reliability.
Solder paste volumes required
for motherboard assembly (mm3)
JEDEC moisture sensitivity level (MSL)
Allowable out of dry-pack storage conditions to avoid
bake-out before reßow£20%RH for up to one year any
condition since MSL1
Bake-out time before reßow (for parts violating out-of-
drypack time)
Recommended assembly reßow proÞle
QualiÞed maximum reßow temperature (°C)
SpeciÞed maximum coplanarity (mm)
Body size for given pin counts
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Ball attached to package with 63Sn37Pb solder
Not moisture sensitiveÑcan be out of dry-pack indeÞnitely before reßow
Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability
Package Attribute
Table 1. Comparison of MotorolaÕs FC PBGA and CBGA Packages
Epoxy/Glass
12 to 14
62Sn36Pb2Ag
0.76
0.64
Soldermask DeÞned (SMD)
Yes
189
179
0.58 (or 23.0 mils)
0.72
No min. Must only apply ßux or paste
to each solder pad
MSL3 (Can be out of dry-pack for 168
hrs at 30°C/60%RH. Exceeding 168
hrs requires bake-out before reßow)
£20%RH for Up to One Year
24 hrs at 125°C
Solder-paste dependent
220-0/+5 (3 passes)
0.20
503 pin (33 mm)
360 pin (25 mm)
255 pin (21 mm)
Flip-Chip PBGA
Ceramic
(Alumina - Al
6.7
10Sn90Pb
0.86
0.86
Metallization
DeÞned
No
302
275
0.72
(or 28.5 mils)
0.58
Minimum of 0.079
Nominal of 0.115
MSL1
Any condition
because MSL1
Not applicable
because MSL1
Solder-paste
dependent
220-0/+5 (3
passes)
0.15
503 pin
360 pin (25 mm)
255 pin (21 mm)
CBGA
(32.5 mm)
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2
O
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