AN1850 Freescale Semiconductor / Motorola, AN1850 Datasheet
AN1850
Related parts for AN1850
AN1850 Summary of contents
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... Table 1 outlines the major differences between the two package types. This document contains information on a new product under development by Motorola. Motorola reserves the right to change or discontinue this product without notice. © Motorola, Inc., 2000. All rights reserved. Order Number: AN1850/D Rev. 0, 5/2000 ...
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General Package Information Table 1. Comparison of MotorolaÕs FC PBGA and CBGA Packages Package Attribute Substrate dielectric material Substrate CTE (ppm/°C) Solder ball composition (weight %) Solder ball diameter (mm) Package solder pad diameter (mm) Package solder pad type Entire ...
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Figure 1 through Figure 4 show a cross-section of each package type. Figure 1 and Figure 3 do not show the die and are not approximately proportional. Solder joint pictures are only approximately proportional. Figure 1. FC PBGA Package Mounted ...
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General Package Information Figure 3. CBGA Package Mounted to a Board 4 Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Figure 4. CBGA Solder Joint ...
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Motherboard Solder Pad Geometries Figure 5 and Figure 6 contain the recommended solder pad geometries for the FC PBGA and the CBGA, respectively. A pad with a 0.58 mm diameter solderable surface that is 0.05 mm smaller than the ...
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Surface Mount Assembly Via Solder Pad Vi a Figure 6. Recommended CBGA Motherboard Solder Pad Geometry. 1.3 Surface Mount Assembly The board assembly process for FC PBGA is basically the same as for CBGA with a couple of exceptions. Due ...
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Board-Level Reliability The two package types behave quite differently with regard to the solder jointÕs ability to withstand repeated board-mounted thermal cycles. The CBGA substrate, with a coefÞcient of thermal expansion (CTE) of 6.7 ppm/¡C, is mismatched to most ...
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Board-Level Reliability Motorola has extensive board-level reliability data on every CBGA body size used for products. Figure 7 contains solder-joint reliability data for the 503-pin, 32.5 mm body Motorola XPC107 mounted to a 1.57- mm thick, four-copper-layer FR-402 epoxy/glass test ...
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Figure 8. Motorola 503-Pin CBGA Package Drawing Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability 9 ...
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Board-Level Reliability Figure 8. Motorola 503-Pin CBGA Package Drawing (Continued) 10 Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability ...
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Figure 9. Motorola 503-Pin Flip-Chip PBGA Package Drawing Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability 11 ...
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Board-Level Reliability Figure 9. Motorola 503-Pin Flip-Chip PBGA Package Drawing (Continued) 12 Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability ...
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Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability 13 ...
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Board-Level Reliability 14 Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability ...
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Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability 15 ...
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... HOME PAGE: http://motorola.com/semiconductors Document Comments: FAX (512) 895-2638, Attn: RISC Applications Engineering World Wide Web Addresses: http://www.motorola.com/PowerPC http://www.motorola.com/netcomm http://www.motorola.com/Coldfire are registered trademarks of Motorola, Inc. Motorola, Inc Equal Opportunity/ - TOUCHTONE 1-602-244-6609 - US & Canada ONLY http://sps.motorola.com/mfax AN1850/D ...