UPD75P3036 NEC, UPD75P3036 Datasheet - Page 54

• Manufacturer Part Number: UPD75P3036
• Description: 4-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC

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15. RECOMMENDED SOLDERING CONDITIONS
Solder the PD75P3036 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document Semiconductor Device
Mounting Technology Manual (C10535E).
For the soldering methods and conditions other than those recommended, consult NEC.
(1) PD75P3036GC-3B9: 80-pin plastic QFP (14 14 mm)
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
(2) PD75P3036GK-BE9: 80-pin plastic TQFP (fine pitch) (12 12 mm)
Note The number of days for storage after the dry pack has been opened. The storage conditions are 25 ˚C, 65 % RH max.
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
Infrared reflow
VPS
Wave soldering
Pin partial heating
Infrared reflow
VPS
Wave soldering
Pin partial heating
Soldering Method
Soldering Method
Package peak temperature: 235 ˚C, Reflow time: 30 seconds or below
(210 ˚C or higher), Number of reflow processes: 3 max.
Package peak temperature: 215 ˚C, Reflow time: 40 seconds or below
(200 ˚C or higher), Number of reflow processes: 3 max.
Solder temperature: 260 ˚C or below, Flow time: 10 seconds or below,
Number of flow processes: 1
Preheating temperature: 120 ˚C or below (package surface temperature)
Pin temperature: 300 ˚C or below, Time: 3 seconds or below (per side of device)
Package peak temperature: 235 ˚C, Reflow time: 30 seconds or below (210 ˚C
or higher), Number of reflow processes: 3 max., Exposure limit: 7 days
(After that, prebaking is necessary at 125 ˚C for 10 hours.)
Package peak temperature: 215 ˚C, Reflow time: 40 seconds or below (200 ˚C
or higher), Number of reflow processes: 3 max., Exposure limit: 7 days
(After that, prebaking is necessary at 125 ˚C for 10 hours.)
Solder temperature: 260 ˚C or below, Flow time: 10 seconds or below,
Number of flow processes: 1,
Preheating temperature: 120 ˚C or below (package surface temperature)
Exposure limit: 7 days
hours.)
Pin temperature: 300 ˚C or below, Time: 3 seconds or below (per side of device)
Table 15-1. Soldering Conditions of Surface Mount Type
Note
(After that, prebaking is necessary at 125 ˚C for 10
Soldering Conditions
Soldering Conditions
Note
Note
IR35-00-3
VP15-00-3
WS60-00-1
IR35-107-3
VP15-107-3
WS60-107-1
Symbol
Symbol
PD75P3036
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