MC33886 Motorola, MC33886 Datasheet - Page 17

• Manufacturer Part Number: MC33886
• Description: 5.0 A H BRIDGE
• Manufacturer: Motorola

The significant feature of this device is the exposed copper pad
on which the power die is soldered. This pad is soldered on a
PCB to provide heat flow to ambient and also to provide thermal
capacitance. The more copper area on the PCB, the better the
power dissipation and transient behavior will be.
side area of copper is 7.8 cm
Figure
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
The 33886 is designed for enhanced thermal performance.
Example Characterization on a double-sided PCB: bottom
19); grid array of 24 vias 0.3 mm in diameter.
Top Side
Figure 19. PCB Test Layout
2
; top surface is 2.7 cm
Freescale Semiconductor, Inc.
For More Information On This Product,
Bottom Side
Go to: www.freescale.com
PACKAGE INFORMATION
2
(see
soldered on to the test PCB described in
Rth (°C/W)
100
Figure 20
0,1
10
1
0,001
0,01
Figure 20. 33886 Thermal Response
shows the thermal response with the device
0,1
1
t, Time (s)
10
Figure
100
19.
1000
33886
10000
17