MCP6G04 Microchip Technology, MCP6G04 Datasheet - Page 29

• Manufacturer Part Number: MCP6G04
• Description: 110 Selectable Gain Amplifier
• Manufacturer: Microchip Technology

14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
© 2006 Microchip Technology Inc.
Note:
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
p
n
β
Dimension Limits
E1
E
Units
A2
A1
E1
B1
A
E
D
n
p
L
c
α
φ
β
MIN
.033
.002
.246
.169
.193
.020
.004
.007
2
1
0
0
0
INCHES
L
φ
NOM
D
.026
.035
.004
.173
.197
.024
.006
.010
.251
14
4
5
5
A1
MAX
A
.043
.037
.006
.256
.177
.028
.008
.012
.201
10
10
8
MIN
MCP6G01/2/3/4
0.85
0.05
6.25
4.30
4.90
0.50
0.09
0.19
0
0
0
MILLIMETERS*
NOM
0.65
0.90
0.10
6.38
4.40
5.00
0.60
0.15
0.25
14
4
5
5
A2
MAX
DS22004A-page 29
1.10
0.95
0.15
6.50
4.50
5.10
0.70
0.20
0.30
α
10
10
8