MCP6G04 Microchip Technology, MCP6G04 Datasheet - Page 27
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MCP6G04
Manufacturer Part Number
MCP6G04
Description
110 Selectable Gain Amplifier
Manufacturer
Microchip Technology
Datasheet
1.MCP6G04.pdf
(36 pages)
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8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
© 2006 Microchip Technology Inc.
Note:
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
p
c
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
§
β
(F)
Dimension Limits
E1
E
Units
A2
A1
E1
D
n
p
A
E
L
F
φ
B
α
β
c
MIN
.030
.002
.184
.114
.114
.016
.035
.004
.010
0
2
1
INCHES
NOM
.026
L
D
.034
.118
.118
.022
.037
.006
.012
.193
φ
8
7
7
A
MAX
A1
.044
.038
.006
.200
.122
.122
.028
.039
.008
.016
6
MCP6G01/2/3/4
MIN
0.76
0.05
4.67
2.90
2.90
0.40
0.90
0.10
0.25
0
MILLIMETERS*
NOM
0.65
4.90
0.86
3.00
3.00
0.55
0.95
0.15
0.30
7
7
DS22004A-page 27
α
8
MAX
.5.08
1.18
0.97
0.15
3.10
3.10
0.70
1.00
0.20
0.40
A2
6