RMPA2059-108 Raytheon RF Components, RMPA2059-108 Datasheet - Page 5

• Manufacturer Part Number: RMPA2059-108
• Description: Type = Wcdma ;; Circuit Description = 3V Wcdma Power Amplifier Module ;; Frequency = 1920-1980 MHZ
• Manufacturer: Raytheon RF Components

RF Components
www.raytheonrf.com
Application
Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
"
"
"
Specifications are based on most current or latest revision.
Revised February 6, 2003
Precautions to Avoid Permanent Device Damage:
Device Usage: Raytheon recommends the following procedures prior to assembly.
Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT
attachment. Hand soldering is not recommended.
RMPA2059-108
3V WCDMA Power Amplifier Module
– Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs.
– Device Cleaning: Standard board cleaning techniques should not present device problems
– Static Sensitivity: Follow ESD precautions to protect against ESD damage:
– General Handling: Handle the package on the top with a vacuum collet or along the edges
– Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition,
– Dry-bake devices at 125 C for 24 hours minimum. Note: The shipping trays cannot withstand
– Assemble the dry-baked devices within 7 days of removal from the oven.
– During the 7-day period, the devices must be stored in an environment of less than 60%
– If the 7-day period or the environmental conditions have been exceeded, then the dry-bake
– Reflow Profile
Devices should remain in their original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
provided that the boards are properly dried to remove solvents or water residues.
with a sharp pair of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the
package bottom. Do not apply excessive pressure to the top of the lid.
devices are protected and require no special storage conditions. Once the sealed bag has
been opened, devices should be stored in a dry nitrogen environment.
125 C baking temperature.
relative humidity and a maximum temperature of 30 C
procedure must be repeated.
• A properly grounded static-dissipative surface on which to place devices.
• Static-dissipative floor or mat.
• A properly grounded conductive wrist strap for each person to wear while handling
• Ramp-up: During this stage the solvents are evaporated from the solder paste. Care
• Pre-heat/soak: The soak temperature stage serves two purposes; the flux is activated and
• Reflow Zone: If the temperature is too high, then devices may be damaged by mechanical
• Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock.
devices.
should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by
violent solvent out-gassing. A typical heating rate is 1- 2°C/sec.
the board and devices achieve a uniform temperature. The recommended soak condition
is: 120-150 seconds at 150°C.
stress due to thermal mismatch or there may be problems due to excessive solder
oxidation. Excessive time at temperature can enhance the formation of inter-metallic
compounds at the lead/board interface and may lead to early mechanical failure of the
joint. Reflow must occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 10 seconds. Maximum soldering temperatures
should be in the range 215-220°C, with a maximum limit of 225°C.
However, rapid cooling promotes a finer grain structure and a more crack-resistant solder
joint. The illustration below indicates the recommended soldering profile.
Page 5
ADVANCED INFORMATION
Raytheon RF Components
Andover, MA 01810
362 Lowell Street