RMPA2059-108 Raytheon RF Components, RMPA2059-108 Datasheet
RMPA2059-108
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RMPA2059-108 Summary of contents
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... WCDMA Power Amplifier Module Description The RMPA2059-108 power amplifier module (PAM) is designed for WCDMA applications. The 2 stage PAM is internally matched to 50 ohms to minimize the use of external components and features a low- power mode to reduce standby current and DC power consumption during peak phone usage. High power-added efficiency and excellent linearity are achieved using Raytheon RF Components’ ...
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... RMPA2059-108 RF Components 3V WCDMA Power Amplifier Module Electrical 1 Characteristics www.raytheonrf.com Specifications are based on most current or latest revision. Revised February 6, 2003 Parameter Symbol Operating Frequency CDMA MODE Gain G Gp Max Linear Power Out Po Power-Added Efficiency PAEd Adjacent Channel ACPR Power Rejection +/-5.0 MHz Offset ACLR1 +/-10 ...
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... RMPA2059-108 RF Components 3V WCDMA Power Amplifier Module Package Outline Package Pinout www.raytheonrf.com Specifications are based on most current or latest revision. Revised February 6, 2003 Signal Section Name Description Input to PA; DC blocked; 5 dBm maximum input RF Out RF Output of PA; DC blocked DC Power Vcc1, Vcc2 DC Supplies of PA ...
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... RMPA2059-108 RF Components 3V WCDMA Power Amplifier Module Evaluation Board Layout Recommended Operating Conditions www.raytheonrf.com Specifications are based on most current or latest revision. Revised February 6, 2003 1) Vcc1=Vcc2=3.4V (typical) DC Turn-On 2) Vref=3.0V (typical) Sequence 3) Vmode=2.0V (Pout <16 dBm), 0V (Pout>16dBm) Parameter Symbol Supply Voltage Vcc1, Vcc2 RF Input Power ...
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... RMPA2059-108 RF Components 3V WCDMA Power Amplifier Module Application Information CAUTION: THIS IS AN ESD SENSITIVE DEVICE. " Precautions to Avoid Permanent Device Damage: – Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices should remain in their original packaging until component placement to ensure no contamination or damage to RF, DC & ...
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... RMPA2059-108 RF Components 3V WCDMA Power Amplifier Module " Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free Application attachment of the heat sink to the PWB. The solder joint should be 95% void-free and be a Information consistent thickness. " Rework Considerations: Rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225° ...